▶ 調査レポート

半導体・電子部品製造の世界市場2021-2026:成長・動向・新型コロナの影響・市場予測

• 英文タイトル:Semiconductor and Electronic Parts Manufacturing Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

Semiconductor and Electronic Parts Manufacturing Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)「半導体・電子部品製造の世界市場2021-2026:成長・動向・新型コロナの影響・市場予測」(市場規模、市場予測)調査レポートです。• レポートコード:MRC2103A457
• 出版社/出版日:Mordor Intelligence / 2021年2月20日
• レポート形態:英文、PDF、120ページ
• 納品方法:Eメール(受注後2-3営業日)
• 産業分類:半導体
• 販売価格(消費税別)
  Single User¥629,000 (USD4,250)▷ お問い合わせ
  Team User¥703,000 (USD4,750)▷ お問い合わせ
  Corporate License¥1,110,000 (USD7,500)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
本調査資料では、世界の半導体・電子部品製造市場について調査し、イントロダクション、調査手法、エグゼクティブサマリー、市場インサイト、市場動向、半導体・電子部品製品状況、コンポーネント別(機器、ソフトウェア、サービス)分析、用途別(通信・ネットワーク機器、輸送、家電、その他)分析、地域別分析、競争状況、投資分析、市場の将来の項目を掲載しています。
・イントロダクション
・調査手法
・エグゼクティブサマリー
・市場インサイト
・市場動向
・半導体・電子部品製品状況
・世界の半導体・電子部品製造市場規模:コンポーネント別(機器、ソフトウェア、サービス)
・世界の半導体・電子部品製造市場規模:用途別(通信・ネットワーク機器、輸送、家電、その他)
・世界の半導体・電子部品製造市場規模:地域別
・競争状況
・投資分析
・市場の将来

The Semiconductor and Electronic Parts Manufacturing Market is expected to register a CAGR of 7.12% over the forecast period from 2021 to 2026. Miniaturization and increasing demand for high performance and energy-efficient electronic devices for applications across consumer devices (smart) further aid the growth. The overall semiconductor industry has been driven by smartphones and other applications across consumer electronics, automotive applications, etc. these industries have been driven by technology transitions, such as wireless technologies (5G) and Artificial intelligence. The electronics manufacturing further entails design and engineering, assembly, manufacturing, and testing services for electronic components and printed circuit board (PCB) assemblies. Aimed at original equipment manufacturers, it simplifies investment on automated assembly equipment. The manufacturer providers take care of different levels of automation, depending on the company and the project.

– In the current market scenario, as almost all the electronic devices, including laptops, smartphones, and computers make use of ICs, PCBs, and other packages, the demand for manufacturing is always on the rise. The increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors may boost the planarization in semiconductor devices. The market dominance of Asia-Pacific is due to the increasing demand for semiconductor fabrication, such as MEMS and NEMS. ​With the advent of miniaturization and adoption of emerging technologies in the Industrial Internet of Things (IIoT) and enhanced communication posed by 5G, the electronic component design and assembly have been revolutionized. For instance, the communication base stations for 5G developed a superior antenna technology, such as MIMO, leading to a rise in the number and performance of radiating elements.
– The overall demand for semiconductor manufacturing is driven by smartphones and other applications across consumer electronics, automotive applications, etc. These industries have been driven by technology transitions such as wireless technologies (5G), Artificial intelligence, etc. Also, the trend of increasing numbers of Internet of Things (IoT) devices is expected to force the semiconductor industry to invest in this equipment, in a bid to attain intelligent products. With favorable market conditions, semiconductor companies(including foundries and OEMs) are spending considerable amounts to maintain their competitiveness, driving the sales of semiconductor equipment according to SEMI. Asia continued its dominance in the overall semiconductor manufacturing market. Additionally, when a manufacturer’s existing capacity reaches optimum utilization, it tends to resort to outsourcing to fuel its expansion goals.
– Furthermore, in November 2019, Viking Enterprise Solutions, a product division of Sanmina Corporation, announced NSS2249, and NVMe storage solution. The solution can double the throughput and bandwidth for enterprise applications, such as storage for edge computing, high-frequency trading, database transaction processing, tiered storage, and supercomputing storage applications. Additionally, the design development of NSS2249 deployed the latest generation of AMD EPYC CPU technology and storage drives based on the PCIe 4.0 specification. During the same time of the year, Integrated Micro-Electronics Inc. released its Vibration Test System for Analytical Testing and Calibration (ATC) laboratory. The test system ensures the product’s strength, durability, and safe functioning during operation or while in transit.
– The recent Coronavirus pandemic is expected to have a significant effect on the semiconductor and electronic parts manufactured across the world. A new quarterly report from SEMI laid out two market scenarios for semiconductor manufacturing in the second half of 2020. First, the sales of semiconductors could witness further dip amid the uncertainty surrounding the impact of COVID-19 to the semiconductor industry. Second, the semiconductor industry could climb on the strength of rebounding chip sales. The majority of electronic parts manufacturers, such as Benchmark Electronics, announced that the financial target of the first quarter of 2020 is unachievable due to the impact of coronavirus. In April 2020, Integrated Micro-Electronics Inc. closed most of its operations at the production sites for safety and protection amid the COVID-19 outbreak.

Key Market Trends

Consumer Electronics is Expected to Hold Significant Share

– This segment’s trend has been to increase the adoption of various devices with an extended battery life of the device. Manufacturers are extending the battery capacity of their devices, and the demand for shorter charging is driving the market growth in this industry. The semiconductor and electronics industry is facing stiff competition from the ICs in this segment. The ICs have been the preferred choice in various devices, but they are highly dependent on semiconductors for their adapters. The smartphone is the major consumer of semiconductors in this segment. The smartphone has been a very competitive market in recent years. The manufacturers are developing charges that could charge the device in a very shorter duration due to which the current rating for these has gone from .5 milliamp to 5 milliamp.
– The trend has been the same for the PC and wearable devices. The manufacturers want their customers to spend less time plugged in. The manufacturers, like OPPO, one plus, Motorola, Samsung, and Apple, provide these fast charge adapters out of the box, and fast charging is the key to their marketing strategy. The more heavy-duty power adapters are used for Laptop and Tv segments. The power adapters operate at a much higher voltage and current for these devices. Recently, U-blox, a provider of positioning and wireless communication technologies, has partnered with TransSiP and Matrix Industries to create PowerWatch 2, a GPS smartwatch that is equipped with energy harvesting technology.
– The continuous miniaturization of microchips, along with the requirement for a more significant degree of functionalities, points to the importance of a 3D-based design framework across the semiconductor industry. ​The devices with upgraded features and increased performance are entering the market at regular intervals. The requirement for such enhanced functionalities has led to the inclusion of thousands of electronic components on a limited amount of space inside these devices. So, there is an increased demand for semiconductor device manufacturing. ​In June 2020, TSMC has announced the development of the 4nm node, and upgradation of the current 5nm process. The miniaturization technology will improve the performance and efficiency of the chips.
– Moreover, NVIDIA, Intel, AMD, Apple, and other TSMC customers are expected to consider it for their future designs. The 5nm node has entered mass production, to the point that Ryzen 4000 is expected to be developed in this process. The company has also finished the 3nm process design framework. And the 3nm chipset is likely to go into production for testing in the first half of 2021. The company is also accelerating the development of the 2nm process. Furthermore, TSMC will even start the mass-production of the first-generation 5nm chips in the fourth quarter of 2020. The company is also in negotiation with the American government to build a 5nm factory in Arizona for a larger plan to make the United States independent of the East.

Asia-Pacific is Expected to Hold Major Share

– The Asia-Pacific region is one of the significant markets for semiconductors and electronic parts manufacturing in the world, owing to its strong position in consumer electronics, semiconductors, and other telecommunications and equipment manufacturing industries. China has about 60-70% of the world’s electronics production and assembly capacity. According to the Semiconductor Industry Association (SIA), the country’s semiconductor sales grew from USD 82.4 billion in 2015 to USD 143.7 billion in 2019. China also leads the world in 5G technology, with full network coverage planned in 50 cities by late-2020. The consumption of semiconductors is rapidly increasing in China, compared to other countries, owing to the continuing transfer of global, diverse electronic equipment to China. The product is a necessary component.
– Additionally, the space industry in China is evolving significantly, with an increasing number of private companies competing in multiple parts of the space industry. With the Chinese space industry starting to adopt advanced technology, major Chinese satellite operators are targeting the opportunity to use satellites in conjunction with 5G to interconnect offices, factories, IoT sensor devices, GPS, aircraft and vehicle navigation, and ship tracking part of hybrid 5G/satellite networks. This is expected to further fuel innovation in the country. China’s State Council’ 2014 “National Integrated Circuit Industry Development Guidelines” set the goal of becoming a global leader in all segments of the semiconductor industry by 2030. The Made in China 2025 initiative is expected to encourage multiple companies to invest in the Chinese market across various sectors.
– In the process of making India a global leader in electronic manufacturing, the government of India in June 2020 has announced three schemes worth of INR 50,000 crore. The new schemes include Production Linked Incentive Scheme, Component Manufacturing Scheme, and Modified Electronics Manufacturing Clusters Scheme will be implemented from June 2020 for the development of the electronics manufacturing sector in India. The trilogy of schemes that entail an outlay of approximately USD 7 billion will help offset the disability for domestic electronics manufacturing, strengthening the electronics manufacturing ecosystem in the country. These schemes are expected to contribute considerably in achieving a USD 1 trillion digital economy and a USD 5 trillion GDP and increase the production of mobile phones and their components to around INR 10,00,000 crore by 2025 in India.
– The outbreak of COVID-19 in January 2020 led to disrupting and halting global supply chains from China. Authorities in China took steps to reduce the mass migration of workers back to factories by shutting down operations in early February 2020. However, as of March 2020, manufacturers anticipated product shipments to be delayed further by 6-7 weeks. Recently, the distributors of electronics components observed an upsurge in orders for multilayer ceramic capacitors, tantalum capacitors, and chip resistors. They attributed such demand to the need for snapping up the inventory to keep production lines running. The distributors also released bids from electronics parts manufacturing in China, which is an implication of a massive shortage of supply. Moreover, the trade tensions between the U.S. and China had also forced semiconductor companies to shift their strategies.

Competitive Landscape

The Semiconductor and Electronic Parts Manufacturing Market is moderately fragmented due to companies such as Jabil Inc., Intel Corporation, Samsung Electronics Co. Ltd, Taiwan Semiconductor Manufacturing Company Limited, etc. The players in the market are launching innovative solutions, forming partnerships, and mergers to increase their market share and expand their geographical presence.

– July 2020 – Intel announced that it had fallen a full 12 months behind schedule in developing its next significant advance in chip-manufacturing technology. In an unexpected development, the company said that as a contingency, it could use other company’s manufacturing facilities if it could not resolve the delay quickly.
– February 2020 – Samsung Electronics announced that its new semiconductor fabrication line in Hwaseong, Korea, has begun mass production. The facility, V1, is Samsung’s first semiconductor production line dedicated to the extreme ultraviolet (EUV) lithography technology and produces chips using a process node of 7 nanometers (nm) and below.

Reasons to Purchase this report:

– The market estimate (ME) sheet in Excel format
– 3 months of analyst support

レポート目次

1 INTRODUCTION
1.1 Study Assumptions​ and Market Definition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS
4.1 Market Overview
4.2 Industry Attractiveness – Porter’s Five Forces Analysis
4.2.1 Bargaining Power of Suppliers
4.2.2 Bargaining Power of Buyers
4.2.3 Threat of New Entrants
4.2.4 Threat of Substitute Products
4.2.5 Intensity of Competitive Rivalry
4.3 Assessment on the impact due to COVID-19

5 MARKET DYNAMICS
5.1 Market Drivers​
5.1.1 Growing Miniaturization
5.1.2 Adoption of Emerging Technologies in IIoT (Industrial Internet of Things), Blockchain, and Enhanced Communication
5.2 Market Challenges
5.2.1 Intensifying Competition and Rigorous Government and Environmental Regulations
5.2.2 Intellectual Property Rights Infringements

6 SEMICONDUCTOR AND ELECTRONIC PARTS PRODUCT LANDSCAPE
6.1 Logic Semiconductor
6.2 Analog Semiconductor
6.3 Memory Semiconductor
6.4 Electronic Connectors and Inductors
6.5 Bare Printed Circuit Boards
6.6 Other Product Types

7 MARKET SEGMENTATION
7.1 By Component
7.1.1 Equipment
7.1.1.1 Front-End Equipment (Lithography, Wafer Surface Conditioning, Wafer Cleaning, and Deposition)
7.1.1.2 Back-End Equipment (Assembly and Packaging, Dicing, Metrology, Bonding, and Wafer Testing)
7.1.2 Software
7.1.3 Services
7.1.3.1 Electronics Design and Engineering
7.1.3.2 Electronics Assembly
7.1.3.3 Electronics Manufacturing
7.1.3.4 Other Service Types
7.2 By Application
7.2.1 Communications and Network Equipment
7.2.2 Transportation
7.2.3 Consumer Electronics
7.2.4 Other Applications
7.3 By Geography
7.3.1 North America
7.3.1.1 United States
7.3.1.2 Canada
7.3.2 Europe
7.3.2.1 United Kingdom
7.3.2.2 Italy
7.3.2.3 Germany
7.3.2.4 France
7.3.2.5 Rest of Europe
7.3.3 Asia-Pacific
7.3.3.1 China
7.3.3.2 Japan
7.3.3.3 South Korea
7.3.3.4 India
7.3.3.5 Rest of Asia-Pacific
7.3.4 Rest of the World

8 COMPETITIVE LANDSCAPE
8.1 Company Profiles
8.1.1 Jabil Inc.
8.1.2 Intel Corporation
8.1.3 Samsung Electronics Co. Ltd
8.1.4 Taiwan Semiconductor Manufacturing Company Limited
8.1.5 SK Hynix Inc.
8.1.6 Micron Technology Inc.
8.1.7 Qualcomm Technologies Inc.
8.1.8 Broadcom Inc.
8.1.9 Texas Instruments Inc.
8.1.10 Sumitronics Corporation
8.1.11 SIIX Corporation
8.1.12 Flex Ltd
8.1.13 Nortech Systems Incorporated

9 INVESTMENT ANALYSIS​​

10 FUTURE OF THE MARKET