• 出版社/出版日：Mordor Intelligence / 2021年2月15日
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The printed sensor market was valued at USD 8.63 billion in 2020, at a CAGR of 6.62% during the forecast period of 2021 – 2026. The printed sensors technology costs less and can be manufactured on a large scale, providing high economies of scale to manufacturers. High demand from smart packaging is another factor driving the growth of the market. Smart packaging helps easier tracking and reduced packaging costs.
– The manufacturers of the printed sensor will have low input costs due to the achievement of economies of trade. Due to the constant design, the manufacturers can achieve economies of trade and thus reducing the cost and maximizing the profit margin.
– Since printed electronics are thin, lightweight, flexible and yet robust, they can be integrated very well into packaging, either during production or as an affixed e-label. This drives the adoption rate of the printed sensor in the smart packaging industry.
– The initial setup of the manufacturing of printed sensors need substantial investment due to the high equipment technology. This acts as a restraint as the high investment costs acts as a barrier for small manufacturers.
Key Market Trends
Consumer Electronics is Expected to Hold Major Market Share
– Printed sensors and arrays offer capabilities in the Consumer Electronics that are unavailable in traditional silicon sensor systems. Printed devices tend to allow for more flexible form factors due to their low profiles and bendable substrates. The material cost can also be reduced by combining the sensors with the measurement system on a single substrate.
– Due to the miniaturizations of devices, the compact form factor is preferred in consumer electronics. Printed sensors can solve these issues with their slim design profile and bendable form factor, as well as their extremely fast responses to stimuli.
– New form factors such as flexible displays, batteries and solar allow consumer electronics companies to differentiate their products compared to the usual rigid box design of electronics.
Asia-Pacific is Expected to Hold Largest Market Share
Asia-Pacific is the next frontier for printed or flexible electronics. Owing to this, the region is witnessing a rise in the investments from foreign companies. Thin Film Electronics ASA, located in the United States, has recently signed a distribution agreement with a Chinese company, CymMetrik.
The agreements aim toward the expansion of sales, particularly in China, Taiwan, India, and other Asia-Pacific nations. The printed electronics technology is experiencing a heavy demand in the continent, owing to the increasing consumer electronics manufacturing practices and thus, is expected to gain considerable traction over the estimated time.
Further, in the case of the consumer electronics sector, the region is experiencing shifting tides that are reflected in the leaders’ market share. Samsung and Apple held a combined 36.3% in 2017, down from nearly 50% just five years earlier.
The printed sensor market consists of several players. In terms of market share, none of the players currently dominate the market. The market is being viewed as a lucrative investment opportunity due to the attractive earnings that can be generated from it.
– November 2019 – FlexEnable has acquired Merck’s portfolio of best-in-class, high-performance Organic Thin-Film Transistor (OTFT) materials, including revolutionary and highly-patented organic semiconductors and dielectrics. The acquisition of Merck’s OTFT materials includes over 300 patents covering materials, processes, and devices. This brings FlexEnable’s total number of organic electronics patents to over 1,000.
– July 2019 – Isorg and Sumitomo Chemical, a global leader in OPD materials production and other fields, had made an agreement to develop new OPD products for use as smartphone fingerprint sensors and hybrid organic-CMOS image sensors.
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1.1 Study Assumptions
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Market Drivers
4.3 Market Restraints
4.4 Industry Attractiveness – Porter’s Five Force Analysis
4.4.1 Threat of New Entrants
4.4.2 Bargaining Power of Buyers/Consumers
4.4.3 Bargaining Power of Suppliers
4.4.4 Threat of Substitute Products
4.4.5 Intensity of Competitive Rivalry
4.5 Technology Snapshot
4.5.1 Inkjet Printing
4.5.2 Screen Printing
4.5.3 Flexographic Printing
4.5.4 Other Printing Technologies
5 MARKET SEGMENTATION
5.1 By End-User Industry
5.1.1 Consumer Electronics
5.1.4 Automotive and Transportation
5.1.5 Other End-user Industries
5.2.1 North America
5.2.4 Rest of the World
6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 FlexEnable Limited
6.1.2 ISORG SA
6.1.3 Plastic Logic HK Ltd.
6.1.4 Renesas Electronics Corporation
6.1.5 Butler Technologies Inc.
6.1.6 Canatu Oy
6.1.7 KWJ Engineering inc. (SPEC Sensors LLC)
6.1.8 Peratech Holdco Limited
6.1.9 Pressure Profile Systems Inc.
6.1.10 T+Ink Inc. (IDTechEx Ltd.)
6.1.11 Tekscan Inc.
6.1.12 Thin Film Electronics ASA.
7 INVESTMENT ANALYSIS
8 MARKET OPPORTUNITIES AND FUTURE TRENDS