世界の薄型ウェーハ市場2021年ｰ2031年：厚さ別（10um以下、10〜29um、30〜49um、50〜99um、100 〜200um、200um以上）、ウェーハサイズ別、材質別、用途別、産業別
• 英文タイトル：Thin Wafers Market (Thickness: Below 10 um, 10 um - 29 um, 30 um - 49 um, 50 um- 99 um, 100 um - 200 um, and Above 200 um; Wafer Size: Below 100 mm, 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm; Material: Silicon [Si], Gallium Arsenide (GaAs), Gallium Nitride [GaN], Silicon Carbide [SiC], and Others [Indium, etc.]; Application: MEMS, CMOS, Memory, Image Sensor, Light Emitting Diode, Interposer, and Others (Radio Frequency Devices, Logic, etc.); and End-use Industry: Consumer Electronics, Automotive, Healthcare, IT and Telecom, Aerospace and Defense, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031• レポートコード：MRC2202A046
• 出版日：2021年11月
世界の薄型ウェーハ市場2021-2031：厚さ別（10um以下、10um〜29 um、30um〜49 um、50um〜99 um、100um〜200 um、200um以上）、ウェーハサイズ別、材料別、用途別、産業別
• 英文タイトル：Thin Wafers Market (Thickness: Below 10 um, 10 um - 29 um, 30 um - 49 um, 50 um- 99 um, 100 um - 200 um, and Above 200 um; Wafer Size: Below 100 mm, 100 mm, 125 mm, 150 mm, 200 mm, and 300 mm; Material: Silicon [Si], Gallium Arsenide (GaAs), Gallium Nitride [GaN], Silicon Carbide [SiC], and Others [Indium, etc.]; Application: MEMS, CMOS, Memory, Image Sensor, Light Emitting Diode, Interposer, and Others (Radio Frequency Devices, Logic, etc.); and End-use Industry: Consumer Electronics, Automotive, Healthcare, IT and Telecom, Aerospace and Defense, and Others) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031• レポートコード：TMR2201B013
• 出版日：2021年11月16日