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世界のIC基板用無電解銅市場 2028年:横型無電解銅、縦型無電解銅

• 英文タイトル:Global Electroless Copper for IC Substrates Market Insights, Forecast to 2028

Global Electroless Copper for IC Substrates Market Insights, Forecast to 2028「世界のIC基板用無電解銅市場 2028年:横型無電解銅、縦型無電解銅」(市場規模、市場予測)調査レポートです。• レポートコード:QY2207C1624
• 出版社/出版日:QYResearch / 2022年7月8日
• レポート形態:英文、PDF、112ページ
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レポート概要
新型コロナウイルス感染症のパンデミックにより、世界のIC基板用無電解銅の市場規模は2022年にUS$xxxと推定され、調査期間中のCAGRはxxx%で、2028年までに再調整された規模はUS$xxxになると予測されています。この医療危機による経済変化を十分に考慮すると、2021年にIC基板用無電解銅の世界市場のxxx%を占める「横型無電解銅」タイプは、2028年までにUS$xxxの規模になり、パンデミック後の修正xxx%CAGRで成長すると予測されています。一方、「PCB」セグメントは、この予測期間を通じてxxx%のCAGRに変更されます。
中国のIC基板用無電解銅の市場規模は2021年にUS$xxxと分析されており、米国とヨーロッパのIC基板用無電解銅市場規模はそれぞれUS$xxxとUS$xxxです。米国の割合は2021年にxxx%であり、中国とヨーロッパはそれぞれxxx%とxxx%です。中国の割合は2028年にxxx%に達し、対象期間を通じてxxx%のCAGRを記録すると予測されています。日本、韓国、東南アジアはアジアで注目市場であり、今後6年間のCAGRはそれぞれxxx%、xxx%、xxx%になる見通しです。ヨーロッパのIC基板用無電解銅市場については、ドイツは2028年までにUS$xxxに達すると予測されており、予測期間中のCAGRはxxx%になる見通しです。

IC基板用無電解銅のグローバル主要メーカーには、DuPont、Atotech、Sharretts Plating、SIMMTECH Graphics、Uyemura、MacDermid Alpha Electronics Solutions、Shinko Electric、ICAPE GROUP、ECI Technology、JX Nippon Mining & Metalsなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx%の市場シェアを占めています。

IC基板用無電解銅市場は、種類と用途によって区分されます。世界のIC基板用無電解銅市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年~2028年期間のタイプ別および用途別の販売量、売上、予測に焦点を当てています。

【種類別セグメント】
横型無電解銅、縦型無電解銅

【用途別セグメント】
PCB、IC基板、半導体ウェーハ、その他

【掲載地域】
北米:アメリカ、カナダ
ヨーロッパ:ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋:日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米:メキシコ、ブラジル、アルゼンチン
中東・アフリカ:トルコ、サウジアラビア、UAE

【目次(一部)】

・調査の範囲
- IC基板用無電解銅製品概要
- 種類別市場(横型無電解銅、縦型無電解銅)
- 用途別市場(PCB、IC基板、半導体ウェーハ、その他)
- 調査の目的
・エグゼクティブサマリー
- 世界のIC基板用無電解銅販売量予測2017-2028
- 世界のIC基板用無電解銅売上予測2017-2028
- IC基板用無電解銅の地域別販売量
- IC基板用無電解銅の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別IC基板用無電解銅販売量
- 主要メーカー別IC基板用無電解銅売上
- 主要メーカー別IC基板用無電解銅価格
- 競争状況の分析
- 企業M&A動向
・種類別市場規模(横型無電解銅、縦型無電解銅)
- IC基板用無電解銅の種類別販売量
- IC基板用無電解銅の種類別売上
- IC基板用無電解銅の種類別価格
・用途別市場規模(PCB、IC基板、半導体ウェーハ、その他)
- IC基板用無電解銅の用途別販売量
- IC基板用無電解銅の用途別売上
- IC基板用無電解銅の用途別価格
・北米市場
- 北米のIC基板用無電解銅市場規模(種類別、用途別)
- 主要国別のIC基板用無電解銅市場規模(アメリカ、カナダ)
・ヨーロッパ市場
- ヨーロッパのIC基板用無電解銅市場規模(種類別、用途別)
- 主要国別のIC基板用無電解銅市場規模(ドイツ、フランス、イギリス、イタリア、ロシア)
・アジア太平洋市場
- アジア太平洋のIC基板用無電解銅市場規模(種類別、用途別)
- 主要国別のIC基板用無電解銅市場規模(日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア)
・中南米市場
- 中南米のIC基板用無電解銅市場規模(種類別、用途別)
- 主要国別のIC基板用無電解銅市場規模(メキシコ、ブラジル、アルゼンチン)
・中東・アフリカ市場
- 中東・アフリカのIC基板用無電解銅市場規模(種類別、用途別)
- 主要国別のIC基板用無電解銅市場規模(トルコ、サウジアラビア)
・企業情報
DuPont、Atotech、Sharretts Plating、SIMMTECH Graphics、Uyemura、MacDermid Alpha Electronics Solutions、Shinko Electric、ICAPE GROUP、ECI Technology、JX Nippon Mining & Metals
・産業チェーン及び販売チャネル分析
- IC基板用無電解銅の産業チェーン分析
- IC基板用無電解銅の原材料
- IC基板用無電解銅の生産プロセス
- IC基板用無電解銅の販売及びマーケティング
- IC基板用無電解銅の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- IC基板用無電解銅の産業動向
- IC基板用無電解銅のマーケットドライバー
- IC基板用無電解銅の課題
- IC基板用無電解銅の阻害要因
・主な調査結果

As IC packaging substrates move toward finer features, semi-additive processing (SAP) becomes more important, which requires uniform thickness and repeatable etch characteristics across the panel. The high-polish electroless copper plating system enables users to reliably cover microvias while minimizing surface copper deposition for enhanced etch capabilities.
Market Analysis and Insights: Global Electroless Copper for IC Substrates Market
Due to the COVID-19 pandemic, the global Electroless Copper for IC Substrates market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the forecast period 2022-2028. Fully considering the economic change by this health crisis, Horizontal Electroless Copper accounting for % of the Electroless Copper for IC Substrates global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While PCB segment is altered to an % CAGR throughout this forecast period.
China Electroless Copper for IC Substrates market size is valued at US$ million in 2021, while the US and Europe Electroless Copper for IC Substrates are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Electroless Copper for IC Substrates landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period 2022-2028.
The global key manufacturers of Electroless Copper for IC Substrates include DuPont, Atotech, Sharretts Plating, SIMMTECH Graphics, Uyemura, MacDermid Alpha Electronics Solutions, Shinko Electric, ICAPE GROUP and ECI Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Electroless Copper for IC Substrates capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Electroless Copper for IC Substrates by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Electroless Copper for IC Substrates Scope and Segment
Electroless Copper for IC Substrates market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Electroless Copper for IC Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Horizontal Electroless Copper
Vertical Electroless Copper
Segment by Application
PCB
IC Substrate
Semiconductor Wafer
Others
By Company
DuPont
Atotech
Sharretts Plating
SIMMTECH Graphics
Uyemura
MacDermid Alpha Electronics Solutions
Shinko Electric
ICAPE GROUP
ECI Technology
JX Nippon Mining & Metals
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

レポート目次

1 Study Coverage
1.1 Electroless Copper for IC Substrates Product Introduction
1.2 Market by Type
1.2.1 Global Electroless Copper for IC Substrates Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Horizontal Electroless Copper
1.2.3 Vertical Electroless Copper
1.3 Market by Application
1.3.1 Global Electroless Copper for IC Substrates Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 PCB
1.3.3 IC Substrate
1.3.4 Semiconductor Wafer
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Electroless Copper for IC Substrates Production
2.1 Global Electroless Copper for IC Substrates Production Capacity (2017-2028)
2.2 Global Electroless Copper for IC Substrates Production by Region: 2017 VS 2021 VS 2028
2.3 Global Electroless Copper for IC Substrates Production by Region
2.3.1 Global Electroless Copper for IC Substrates Historic Production by Region (2017-2022)
2.3.2 Global Electroless Copper for IC Substrates Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Global Electroless Copper for IC Substrates Sales in Volume & Value Estimates and Forecasts
3.1 Global Electroless Copper for IC Substrates Sales Estimates and Forecasts 2017-2028
3.2 Global Electroless Copper for IC Substrates Revenue Estimates and Forecasts 2017-2028
3.3 Global Electroless Copper for IC Substrates Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Electroless Copper for IC Substrates Sales by Region
3.4.1 Global Electroless Copper for IC Substrates Sales by Region (2017-2022)
3.4.2 Global Sales Electroless Copper for IC Substrates by Region (2023-2028)
3.5 Global Electroless Copper for IC Substrates Revenue by Region
3.5.1 Global Electroless Copper for IC Substrates Revenue by Region (2017-2022)
3.5.2 Global Electroless Copper for IC Substrates Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Electroless Copper for IC Substrates Production Capacity by Manufacturers
4.2 Global Electroless Copper for IC Substrates Sales by Manufacturers
4.2.1 Global Electroless Copper for IC Substrates Sales by Manufacturers (2017-2022)
4.2.2 Global Electroless Copper for IC Substrates Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Electroless Copper for IC Substrates in 2021
4.3 Global Electroless Copper for IC Substrates Revenue by Manufacturers
4.3.1 Global Electroless Copper for IC Substrates Revenue by Manufacturers (2017-2022)
4.3.2 Global Electroless Copper for IC Substrates Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Electroless Copper for IC Substrates Revenue in 2021
4.4 Global Electroless Copper for IC Substrates Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Electroless Copper for IC Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Electroless Copper for IC Substrates Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Electroless Copper for IC Substrates Sales by Type
5.1.1 Global Electroless Copper for IC Substrates Historical Sales by Type (2017-2022)
5.1.2 Global Electroless Copper for IC Substrates Forecasted Sales by Type (2023-2028)
5.1.3 Global Electroless Copper for IC Substrates Sales Market Share by Type (2017-2028)
5.2 Global Electroless Copper for IC Substrates Revenue by Type
5.2.1 Global Electroless Copper for IC Substrates Historical Revenue by Type (2017-2022)
5.2.2 Global Electroless Copper for IC Substrates Forecasted Revenue by Type (2023-2028)
5.2.3 Global Electroless Copper for IC Substrates Revenue Market Share by Type (2017-2028)
5.3 Global Electroless Copper for IC Substrates Price by Type
5.3.1 Global Electroless Copper for IC Substrates Price by Type (2017-2022)
5.3.2 Global Electroless Copper for IC Substrates Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Electroless Copper for IC Substrates Sales by Application
6.1.1 Global Electroless Copper for IC Substrates Historical Sales by Application (2017-2022)
6.1.2 Global Electroless Copper for IC Substrates Forecasted Sales by Application (2023-2028)
6.1.3 Global Electroless Copper for IC Substrates Sales Market Share by Application (2017-2028)
6.2 Global Electroless Copper for IC Substrates Revenue by Application
6.2.1 Global Electroless Copper for IC Substrates Historical Revenue by Application (2017-2022)
6.2.2 Global Electroless Copper for IC Substrates Forecasted Revenue by Application (2023-2028)
6.2.3 Global Electroless Copper for IC Substrates Revenue Market Share by Application (2017-2028)
6.3 Global Electroless Copper for IC Substrates Price by Application
6.3.1 Global Electroless Copper for IC Substrates Price by Application (2017-2022)
6.3.2 Global Electroless Copper for IC Substrates Price Forecast by Application (2023-2028)
7 North America
7.1 North America Electroless Copper for IC Substrates Market Size by Type
7.1.1 North America Electroless Copper for IC Substrates Sales by Type (2017-2028)
7.1.2 North America Electroless Copper for IC Substrates Revenue by Type (2017-2028)
7.2 North America Electroless Copper for IC Substrates Market Size by Application
7.2.1 North America Electroless Copper for IC Substrates Sales by Application (2017-2028)
7.2.2 North America Electroless Copper for IC Substrates Revenue by Application (2017-2028)
7.3 North America Electroless Copper for IC Substrates Sales by Country
7.3.1 North America Electroless Copper for IC Substrates Sales by Country (2017-2028)
7.3.2 North America Electroless Copper for IC Substrates Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Electroless Copper for IC Substrates Market Size by Type
8.1.1 Europe Electroless Copper for IC Substrates Sales by Type (2017-2028)
8.1.2 Europe Electroless Copper for IC Substrates Revenue by Type (2017-2028)
8.2 Europe Electroless Copper for IC Substrates Market Size by Application
8.2.1 Europe Electroless Copper for IC Substrates Sales by Application (2017-2028)
8.2.2 Europe Electroless Copper for IC Substrates Revenue by Application (2017-2028)
8.3 Europe Electroless Copper for IC Substrates Sales by Country
8.3.1 Europe Electroless Copper for IC Substrates Sales by Country (2017-2028)
8.3.2 Europe Electroless Copper for IC Substrates Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Electroless Copper for IC Substrates Market Size by Type
9.1.1 Asia Pacific Electroless Copper for IC Substrates Sales by Type (2017-2028)
9.1.2 Asia Pacific Electroless Copper for IC Substrates Revenue by Type (2017-2028)
9.2 Asia Pacific Electroless Copper for IC Substrates Market Size by Application
9.2.1 Asia Pacific Electroless Copper for IC Substrates Sales by Application (2017-2028)
9.2.2 Asia Pacific Electroless Copper for IC Substrates Revenue by Application (2017-2028)
9.3 Asia Pacific Electroless Copper for IC Substrates Sales by Region
9.3.1 Asia Pacific Electroless Copper for IC Substrates Sales by Region (2017-2028)
9.3.2 Asia Pacific Electroless Copper for IC Substrates Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Electroless Copper for IC Substrates Market Size by Type
10.1.1 Latin America Electroless Copper for IC Substrates Sales by Type (2017-2028)
10.1.2 Latin America Electroless Copper for IC Substrates Revenue by Type (2017-2028)
10.2 Latin America Electroless Copper for IC Substrates Market Size by Application
10.2.1 Latin America Electroless Copper for IC Substrates Sales by Application (2017-2028)
10.2.2 Latin America Electroless Copper for IC Substrates Revenue by Application (2017-2028)
10.3 Latin America Electroless Copper for IC Substrates Sales by Country
10.3.1 Latin America Electroless Copper for IC Substrates Sales by Country (2017-2028)
10.3.2 Latin America Electroless Copper for IC Substrates Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa Electroless Copper for IC Substrates Market Size by Type
11.1.1 Middle East and Africa Electroless Copper for IC Substrates Sales by Type (2017-2028)
11.1.2 Middle East and Africa Electroless Copper for IC Substrates Revenue by Type (2017-2028)
11.2 Middle East and Africa Electroless Copper for IC Substrates Market Size by Application
11.2.1 Middle East and Africa Electroless Copper for IC Substrates Sales by Application (2017-2028)
11.2.2 Middle East and Africa Electroless Copper for IC Substrates Revenue by Application (2017-2028)
11.3 Middle East and Africa Electroless Copper for IC Substrates Sales by Country
11.3.1 Middle East and Africa Electroless Copper for IC Substrates Sales by Country (2017-2028)
11.3.2 Middle East and Africa Electroless Copper for IC Substrates Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 DuPont
12.1.1 DuPont Corporation Information
12.1.2 DuPont Overview
12.1.3 DuPont Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 DuPont Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 DuPont Recent Developments
12.2 Atotech
12.2.1 Atotech Corporation Information
12.2.2 Atotech Overview
12.2.3 Atotech Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Atotech Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Atotech Recent Developments
12.3 Sharretts Plating
12.3.1 Sharretts Plating Corporation Information
12.3.2 Sharretts Plating Overview
12.3.3 Sharretts Plating Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Sharretts Plating Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Sharretts Plating Recent Developments
12.4 SIMMTECH Graphics
12.4.1 SIMMTECH Graphics Corporation Information
12.4.2 SIMMTECH Graphics Overview
12.4.3 SIMMTECH Graphics Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 SIMMTECH Graphics Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 SIMMTECH Graphics Recent Developments
12.5 Uyemura
12.5.1 Uyemura Corporation Information
12.5.2 Uyemura Overview
12.5.3 Uyemura Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Uyemura Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Uyemura Recent Developments
12.6 MacDermid Alpha Electronics Solutions
12.6.1 MacDermid Alpha Electronics Solutions Corporation Information
12.6.2 MacDermid Alpha Electronics Solutions Overview
12.6.3 MacDermid Alpha Electronics Solutions Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 MacDermid Alpha Electronics Solutions Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 MacDermid Alpha Electronics Solutions Recent Developments
12.7 Shinko Electric
12.7.1 Shinko Electric Corporation Information
12.7.2 Shinko Electric Overview
12.7.3 Shinko Electric Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Shinko Electric Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Shinko Electric Recent Developments
12.8 ICAPE GROUP
12.8.1 ICAPE GROUP Corporation Information
12.8.2 ICAPE GROUP Overview
12.8.3 ICAPE GROUP Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 ICAPE GROUP Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 ICAPE GROUP Recent Developments
12.9 ECI Technology
12.9.1 ECI Technology Corporation Information
12.9.2 ECI Technology Overview
12.9.3 ECI Technology Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 ECI Technology Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 ECI Technology Recent Developments
12.10 JX Nippon Mining & Metals
12.10.1 JX Nippon Mining & Metals Corporation Information
12.10.2 JX Nippon Mining & Metals Overview
12.10.3 JX Nippon Mining & Metals Electroless Copper for IC Substrates Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 JX Nippon Mining & Metals Electroless Copper for IC Substrates Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 JX Nippon Mining & Metals Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Electroless Copper for IC Substrates Industry Chain Analysis
13.2 Electroless Copper for IC Substrates Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Electroless Copper for IC Substrates Production Mode & Process
13.4 Electroless Copper for IC Substrates Sales and Marketing
13.4.1 Electroless Copper for IC Substrates Sales Channels
13.4.2 Electroless Copper for IC Substrates Distributors
13.5 Electroless Copper for IC Substrates Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Electroless Copper for IC Substrates Industry Trends
14.2 Electroless Copper for IC Substrates Market Drivers
14.3 Electroless Copper for IC Substrates Market Challenges
14.4 Electroless Copper for IC Substrates Market Restraints
15 Key Finding in The Global Electroless Copper for IC Substrates Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer