▶ 調査レポート

電子製品用包装材料の世界市場2023年:セラミック包装材料、プラスチック包装材料、金属包装材料

• 英文タイトル:Global Electronic Product Packaging Materials Market Research Report 2023

Global Electronic Product Packaging Materials Market Research Report 2023「電子製品用包装材料の世界市場2023年:セラミック包装材料、プラスチック包装材料、金属包装材料」(市場規模、市場予測)調査レポートです。• レポートコード:MRC23Q31831
• 出版社/出版日:QYResearch / 2023年3月
• レポート形態:英文、PDF、98ページ
• 納品方法:Eメール(2-3日)
• 産業分類:化学&材料
• 販売価格(消費税別)
  Single User¥429,200 (USD2,900)▷ お問い合わせ
  Enterprise License¥858,400 (USD5,800)▷ お問い合わせ
• ご注文方法:お問い合わせフォーム記入又はEメールでご連絡ください。
• お支払方法:銀行振込(納品後、ご請求書送付)
レポート概要
本調査レポートは世界の電子製品用包装材料市場について調査・分析し、世界の電子製品用包装材料市場概要、メーカー別競争状況、地域別生産量、地域別消費量、タイプ別セグメント分析(セラミック包装材料、プラスチック包装材料、金属包装材料)、用途別セグメント分析(電子産業、半導体産業)、主要企業のプロファイル、市場動向などに関する情報を掲載しています。主要企業としては、GWP Group、THIMM、Universal Protective Packaging, Inc. (UPPI)、Electronic Products Inc.(EPI)、AMETEK ECP、DuPont、Maco PKG、Kyocera、Shinko、Ibiden、LG Innotek、Unimicron Technology、ZhenDing Tech、Semcoなどが含まれています。
世界の電子製品用包装材料市場は、2022年にXXX米ドル、2029年にはXXX米ドルに達すると予測され、予測期間中の年平均成長率はXXX%です。COVID-19とロシア・ウクライナ戦争による影響は、電子製品用包装材料市場規模を推定する際に考慮しました。本レポートは、電子製品用包装材料の世界市場を定量的・定性的な分析により包括的に提示し、読者がビジネス/成長戦略を策定し、市場競争状況を把握し、現在の市場における自社のポジションを分析し、電子製品用包装材料に関するビジネス上の意思決定に役立てることを目的としています。

・電子製品用包装材料市場の概要
- 製品の定義
- 電子製品用包装材料のタイプ別セグメント
- 世界の電子製品用包装材料市場成長率のタイプ別分析(セラミック包装材料、プラスチック包装材料、金属包装材料)
- 電子製品用包装材料の用途別セグメント
- 世界の電子製品用包装材料市場成長率の用途別分析(電子産業、半導体産業)
- 世界市場の成長展望
- 世界の電子製品用包装材料生産量の推定と予測(2018年-2029年)
- 世界の電子製品用包装材料生産能力の推定と予測(2018年-2029年)
- 電子製品用包装材料の平均価格の推定と予測(2018年-2029年)
- 前提条件と制限事項

・メーカー別競争状況
- メーカー別市場シェア
- 世界の主要メーカー、業界ランキング分析
- メーカー別平均価格
- 電子製品用包装材料市場の競争状況およびトレンド

・電子製品用包装材料の地域別生産量
- 電子製品用包装材料生産量の地域別推計と予測(2018年-2029年)
- 地域別電子製品用包装材料価格分析(2018年-2023年)
- 北米の電子製品用包装材料生産規模(2018年-2029年)
- ヨーロッパの電子製品用包装材料生産規模(2018年-2029年)
- 中国の電子製品用包装材料生産規模(2018年-2029年)
- 日本の電子製品用包装材料生産規模(2018年-2029年)
- 韓国の電子製品用包装材料生産規模(2018年-2029年)
- インドの電子製品用包装材料生産規模(2018年-2029年)

・電子製品用包装材料の地域別消費量
- 電子製品用包装材料消費量の地域別推計と予測(2018年-2029年)
- 北米の電子製品用包装材料消費量(2018年-2029年)
- アメリカの電子製品用包装材料消費量(2018年-2029年)
- ヨーロッパの電子製品用包装材料消費量(2018年-2029年)
- アジア太平洋の電子製品用包装材料消費量(2018年-2029年)
- 中国の電子製品用包装材料消費量(2018年-2029年)
- 日本の電子製品用包装材料消費量(2018年-2029年)
- 韓国の電子製品用包装材料消費量(2018年-2029年)
- 東南アジアの電子製品用包装材料消費量(2018年-2029年)
- インドの電子製品用包装材料消費量(2018年-2029年)
- 中南米・中東・アフリカの電子製品用包装材料消費量(2018年-2029年)

・タイプ別セグメント:セラミック包装材料、プラスチック包装材料、金属包装材料
- 世界の電子製品用包装材料のタイプ別生産量(2018年-2023年)
- 世界の電子製品用包装材料のタイプ別生産量(2024年-2029年)
- 世界の電子製品用包装材料のタイプ別価格

・用途別セグメント:電子産業、半導体産業
- 世界の電子製品用包装材料の用途別生産量(2018年-2023年)
- 世界の電子製品用包装材料の用途別生産量(2024年-2029年)
- 世界の電子製品用包装材料の用途別価格

・主要企業のプロファイル:企業情報、製品ポートフォリオ、生産量、価格、動向
GWP Group、THIMM、Universal Protective Packaging, Inc. (UPPI)、Electronic Products Inc.(EPI)、AMETEK ECP、DuPont、Maco PKG、Kyocera、Shinko、Ibiden、LG Innotek、Unimicron Technology、ZhenDing Tech、Semco

・産業チェーンと販売チャネルの分析
- 電子製品用包装材料産業チェーン分析
- 電子製品用包装材料の主要原材料
- 電子製品用包装材料の販売チャネル
- 電子製品用包装材料のディストリビューター
- 電子製品用包装材料の主要顧客

・電子製品用包装材料市場ダイナミクス
- 電子製品用包装材料の業界動向
- 電子製品用包装材料市場の成長ドライバ、課題、阻害要因

・調査成果および結論

・調査方法とデータソース

This report studies the Electronic Packaging Materials market.

Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
The global Electronic Product Packaging Materials market was valued at US$ 5484.7 million in 2022 and is anticipated to reach US$ 6917.2 million by 2029, witnessing a CAGR of 3.3% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market.
China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Electronic Product Packaging Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Product Packaging Materials.
The Electronic Product Packaging Materials market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Electronic Product Packaging Materials market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electronic Product Packaging Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
GWP Group
THIMM
Universal Protective Packaging, Inc. (UPPI)
Electronic Products Inc.(EPI)
AMETEK ECP
DuPont
Maco PKG
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
Segment by Type
Ceramic Based Packaging Materials
Plastic Based Packaging Materials
Metal-Based Packaging Materials
Segment by Application
Electronic Industry
Semiconductor Industry
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electronic Product Packaging Materials manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electronic Product Packaging Materials by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electronic Product Packaging Materials in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

レポート目次

1 Electronic Product Packaging Materials Market Overview
1.1 Product Definition
1.2 Electronic Product Packaging Materials Segment by Type
1.2.1 Global Electronic Product Packaging Materials Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Ceramic Based Packaging Materials
1.2.3 Plastic Based Packaging Materials
1.2.4 Metal-Based Packaging Materials
1.3 Electronic Product Packaging Materials Segment by Application
1.3.1 Global Electronic Product Packaging Materials Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Electronic Industry
1.3.3 Semiconductor Industry
1.4 Global Market Growth Prospects
1.4.1 Global Electronic Product Packaging Materials Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Electronic Product Packaging Materials Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Electronic Product Packaging Materials Production Estimates and Forecasts (2018-2029)
1.4.4 Global Electronic Product Packaging Materials Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Electronic Product Packaging Materials Production Market Share by Manufacturers (2018-2023)
2.2 Global Electronic Product Packaging Materials Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Electronic Product Packaging Materials, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Electronic Product Packaging Materials Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Electronic Product Packaging Materials Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Electronic Product Packaging Materials, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electronic Product Packaging Materials, Product Offered and Application
2.8 Global Key Manufacturers of Electronic Product Packaging Materials, Date of Enter into This Industry
2.9 Electronic Product Packaging Materials Market Competitive Situation and Trends
2.9.1 Electronic Product Packaging Materials Market Concentration Rate
2.9.2 Global 5 and 10 Largest Electronic Product Packaging Materials Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electronic Product Packaging Materials Production by Region
3.1 Global Electronic Product Packaging Materials Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Electronic Product Packaging Materials Production Value by Region (2018-2029)
3.2.1 Global Electronic Product Packaging Materials Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Electronic Product Packaging Materials by Region (2024-2029)
3.3 Global Electronic Product Packaging Materials Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Electronic Product Packaging Materials Production by Region (2018-2029)
3.4.1 Global Electronic Product Packaging Materials Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Electronic Product Packaging Materials by Region (2024-2029)
3.5 Global Electronic Product Packaging Materials Market Price Analysis by Region (2018-2023)
3.6 Global Electronic Product Packaging Materials Production and Value, Year-over-Year Growth
3.6.1 North America Electronic Product Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Electronic Product Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Electronic Product Packaging Materials Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Electronic Product Packaging Materials Production Value Estimates and Forecasts (2018-2029)
4 Electronic Product Packaging Materials Consumption by Region
4.1 Global Electronic Product Packaging Materials Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Electronic Product Packaging Materials Consumption by Region (2018-2029)
4.2.1 Global Electronic Product Packaging Materials Consumption by Region (2018-2023)
4.2.2 Global Electronic Product Packaging Materials Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Electronic Product Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Electronic Product Packaging Materials Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electronic Product Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Electronic Product Packaging Materials Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electronic Product Packaging Materials Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Electronic Product Packaging Materials Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electronic Product Packaging Materials Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Electronic Product Packaging Materials Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Electronic Product Packaging Materials Production by Type (2018-2029)
5.1.1 Global Electronic Product Packaging Materials Production by Type (2018-2023)
5.1.2 Global Electronic Product Packaging Materials Production by Type (2024-2029)
5.1.3 Global Electronic Product Packaging Materials Production Market Share by Type (2018-2029)
5.2 Global Electronic Product Packaging Materials Production Value by Type (2018-2029)
5.2.1 Global Electronic Product Packaging Materials Production Value by Type (2018-2023)
5.2.2 Global Electronic Product Packaging Materials Production Value by Type (2024-2029)
5.2.3 Global Electronic Product Packaging Materials Production Value Market Share by Type (2018-2029)
5.3 Global Electronic Product Packaging Materials Price by Type (2018-2029)
6 Segment by Application
6.1 Global Electronic Product Packaging Materials Production by Application (2018-2029)
6.1.1 Global Electronic Product Packaging Materials Production by Application (2018-2023)
6.1.2 Global Electronic Product Packaging Materials Production by Application (2024-2029)
6.1.3 Global Electronic Product Packaging Materials Production Market Share by Application (2018-2029)
6.2 Global Electronic Product Packaging Materials Production Value by Application (2018-2029)
6.2.1 Global Electronic Product Packaging Materials Production Value by Application (2018-2023)
6.2.2 Global Electronic Product Packaging Materials Production Value by Application (2024-2029)
6.2.3 Global Electronic Product Packaging Materials Production Value Market Share by Application (2018-2029)
6.3 Global Electronic Product Packaging Materials Price by Application (2018-2029)
7 Key Companies Profiled
7.1 GWP Group
7.1.1 GWP Group Electronic Product Packaging Materials Corporation Information
7.1.2 GWP Group Electronic Product Packaging Materials Product Portfolio
7.1.3 GWP Group Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.1.4 GWP Group Main Business and Markets Served
7.1.5 GWP Group Recent Developments/Updates
7.2 THIMM
7.2.1 THIMM Electronic Product Packaging Materials Corporation Information
7.2.2 THIMM Electronic Product Packaging Materials Product Portfolio
7.2.3 THIMM Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.2.4 THIMM Main Business and Markets Served
7.2.5 THIMM Recent Developments/Updates
7.3 Universal Protective Packaging, Inc. (UPPI)
7.3.1 Universal Protective Packaging, Inc. (UPPI) Electronic Product Packaging Materials Corporation Information
7.3.2 Universal Protective Packaging, Inc. (UPPI) Electronic Product Packaging Materials Product Portfolio
7.3.3 Universal Protective Packaging, Inc. (UPPI) Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Universal Protective Packaging, Inc. (UPPI) Main Business and Markets Served
7.3.5 Universal Protective Packaging, Inc. (UPPI) Recent Developments/Updates
7.4 Electronic Products Inc.(EPI)
7.4.1 Electronic Products Inc.(EPI) Electronic Product Packaging Materials Corporation Information
7.4.2 Electronic Products Inc.(EPI) Electronic Product Packaging Materials Product Portfolio
7.4.3 Electronic Products Inc.(EPI) Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Electronic Products Inc.(EPI) Main Business and Markets Served
7.4.5 Electronic Products Inc.(EPI) Recent Developments/Updates
7.5 AMETEK ECP
7.5.1 AMETEK ECP Electronic Product Packaging Materials Corporation Information
7.5.2 AMETEK ECP Electronic Product Packaging Materials Product Portfolio
7.5.3 AMETEK ECP Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.5.4 AMETEK ECP Main Business and Markets Served
7.5.5 AMETEK ECP Recent Developments/Updates
7.6 DuPont
7.6.1 DuPont Electronic Product Packaging Materials Corporation Information
7.6.2 DuPont Electronic Product Packaging Materials Product Portfolio
7.6.3 DuPont Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.6.4 DuPont Main Business and Markets Served
7.6.5 DuPont Recent Developments/Updates
7.7 Maco PKG
7.7.1 Maco PKG Electronic Product Packaging Materials Corporation Information
7.7.2 Maco PKG Electronic Product Packaging Materials Product Portfolio
7.7.3 Maco PKG Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Maco PKG Main Business and Markets Served
7.7.5 Maco PKG Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera Electronic Product Packaging Materials Corporation Information
7.8.2 Kyocera Electronic Product Packaging Materials Product Portfolio
7.8.3 Kyocera Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.9 Shinko
7.9.1 Shinko Electronic Product Packaging Materials Corporation Information
7.9.2 Shinko Electronic Product Packaging Materials Product Portfolio
7.9.3 Shinko Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Shinko Main Business and Markets Served
7.9.5 Shinko Recent Developments/Updates
7.10 Ibiden
7.10.1 Ibiden Electronic Product Packaging Materials Corporation Information
7.10.2 Ibiden Electronic Product Packaging Materials Product Portfolio
7.10.3 Ibiden Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Ibiden Main Business and Markets Served
7.10.5 Ibiden Recent Developments/Updates
7.11 LG Innotek
7.11.1 LG Innotek Electronic Product Packaging Materials Corporation Information
7.11.2 LG Innotek Electronic Product Packaging Materials Product Portfolio
7.11.3 LG Innotek Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.11.4 LG Innotek Main Business and Markets Served
7.11.5 LG Innotek Recent Developments/Updates
7.12 Unimicron Technology
7.12.1 Unimicron Technology Electronic Product Packaging Materials Corporation Information
7.12.2 Unimicron Technology Electronic Product Packaging Materials Product Portfolio
7.12.3 Unimicron Technology Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Unimicron Technology Main Business and Markets Served
7.12.5 Unimicron Technology Recent Developments/Updates
7.13 ZhenDing Tech
7.13.1 ZhenDing Tech Electronic Product Packaging Materials Corporation Information
7.13.2 ZhenDing Tech Electronic Product Packaging Materials Product Portfolio
7.13.3 ZhenDing Tech Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.13.4 ZhenDing Tech Main Business and Markets Served
7.13.5 ZhenDing Tech Recent Developments/Updates
7.14 Semco
7.14.1 Semco Electronic Product Packaging Materials Corporation Information
7.14.2 Semco Electronic Product Packaging Materials Product Portfolio
7.14.3 Semco Electronic Product Packaging Materials Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Semco Main Business and Markets Served
7.14.5 Semco Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electronic Product Packaging Materials Industry Chain Analysis
8.2 Electronic Product Packaging Materials Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electronic Product Packaging Materials Production Mode & Process
8.4 Electronic Product Packaging Materials Sales and Marketing
8.4.1 Electronic Product Packaging Materials Sales Channels
8.4.2 Electronic Product Packaging Materials Distributors
8.5 Electronic Product Packaging Materials Customers
9 Electronic Product Packaging Materials Market Dynamics
9.1 Electronic Product Packaging Materials Industry Trends
9.2 Electronic Product Packaging Materials Market Drivers
9.3 Electronic Product Packaging Materials Market Challenges
9.4 Electronic Product Packaging Materials Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer