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| 新型コロナウイルス感染症とロシア・ウクライナ戦争の影響により、ウエハーダイシング用保護フィルムのグローバル市場は 2022にxxxドルと推定され、2028年までにxxxドルの規模に達し、2022年から2028年の予測期間中にxxx%のCAGRで成長すると予測されています。 ウエハーダイシング用保護フィルムのアメリカ市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。 ウエハーダイシング用保護フィルムの中国市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。 ウエハーダイシング用保護フィルムのヨーロッパ市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。 生産面において、本レポートは2017年から2022年までのウエハーダイシング用保護フィルムの生産、成長率、メーカー別市場シェア、地域別市場シェア、および2028年までの予測を調査しています。販売面において、本レポートは2017年から2022年までの地域別、企業別、タイプ別、アプリケーション別のウエハーダイシング用保護フィルムの売上および2028年までの予測に焦点を当てています。 ウエハーダイシング用保護フィルムのグローバル主要企業には、Nitto、Lintec Corporation、Mitsui Chemicals Tohcello、Denka、Showa Denko Materials、Sekisui Chemical、AI Technology、Sumitomo Bakelite、Minitron、Furukawa Electric、WaferChem Technology、Loadpoint、DSK Technologies Pte Ltd、Maxell、S3 Alliance、Semiconductor Equipment Corporation、Acupaq、Great Rich Technology、D&X、AMC Co, Ltdなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。 ウエハーダイシング用保護フィルム市場は、タイプとアプリケーションによって区分されます。世界のウエハーダイシング用保護フィルム市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別およびアプリケーション別の販売量、売上、予測に焦点を当てています。 【タイプ別セグメント】 ノンUVフィルム、UVフィルム 【アプリケーション別セグメント】 シリコンウェーハ、GaAsウェーハ、その他 【掲載地域】 北米：アメリカ、カナダ ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア 中南米：メキシコ、ブラジル、アルゼンチン 中東・アフリカ：トルコ、サウジアラビア、UAE 【目次（一部）】 ・調査の範囲 - ウエハーダイシング用保護フィルム製品概要 - タイプ別市場（ノンUVフィルム、UVフィルム） - アプリケーション別市場（シリコンウェーハ、GaAsウェーハ、その他） - 調査の目的 ・エグゼクティブサマリー - 世界のウエハーダイシング用保護フィルム販売量予測2017-2028 - 世界のウエハーダイシング用保護フィルム売上予測2017-2028 - ウエハーダイシング用保護フィルムの地域別販売量 - ウエハーダイシング用保護フィルムの地域別売上 - 北米市場 - ヨーロッパ市場 - アジア太平洋市場 - 中南米市場 - 中東・アフリカ市場 ・メーカーの競争状況 - 主要メーカー別ウエハーダイシング用保護フィルム販売量 - 主要メーカー別ウエハーダイシング用保護フィルム売上 - 主要メーカー別ウエハーダイシング用保護フィルム価格 - 競争状況の分析 - 企業M&A動向 ・タイプ別市場規模（ノンUVフィルム、UVフィルム） - ウエハーダイシング用保護フィルムのタイプ別販売量 - ウエハーダイシング用保護フィルムのタイプ別売上 - ウエハーダイシング用保護フィルムのタイプ別価格 ・アプリケーション別市場規模（シリコンウェーハ、GaAsウェーハ、その他） - ウエハーダイシング用保護フィルムのアプリケーション別販売量 - ウエハーダイシング用保護フィルムのアプリケーション別売上 - ウエハーダイシング用保護フィルムのアプリケーション別価格 ・北米市場 - 北米のウエハーダイシング用保護フィルム市場規模（タイプ別、アプリケーション別） - 主要国別のウエハーダイシング用保護フィルム市場規模（アメリカ、カナダ） ・ヨーロッパ市場 - ヨーロッパのウエハーダイシング用保護フィルム市場規模（タイプ別、アプリケーション別） - 主要国別のウエハーダイシング用保護フィルム市場規模（ドイツ、フランス、イギリス、イタリア、ロシア） ・アジア太平洋市場 - アジア太平洋のウエハーダイシング用保護フィルム市場規模（タイプ別、アプリケーション別） - 主要国別のウエハーダイシング用保護フィルム市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア） ・中南米市場 - 中南米のウエハーダイシング用保護フィルム市場規模（タイプ別、アプリケーション別） - 主要国別のウエハーダイシング用保護フィルム市場規模（メキシコ、ブラジル、アルゼンチン） ・中東・アフリカ市場 - 中東・アフリカのウエハーダイシング用保護フィルム市場規模（タイプ別、アプリケーション別） - 主要国別のウエハーダイシング用保護フィルム市場規模（トルコ、サウジアラビア） ・企業情報 Nitto、Lintec Corporation、Mitsui Chemicals Tohcello、Denka、Showa Denko Materials、Sekisui Chemical、AI Technology、Sumitomo Bakelite、Minitron、Furukawa Electric、WaferChem Technology、Loadpoint、DSK Technologies Pte Ltd、Maxell、S3 Alliance、Semiconductor Equipment Corporation、Acupaq、Great Rich Technology、D&X、AMC Co, Ltd ・産業チェーン及び販売チャネル分析 - ウエハーダイシング用保護フィルムの産業チェーン分析 - ウエハーダイシング用保護フィルムの原材料 - ウエハーダイシング用保護フィルムの生産プロセス - ウエハーダイシング用保護フィルムの販売及びマーケティング - ウエハーダイシング用保護フィルムの主要顧客 ・マーケットドライバー、機会、課題、リスク要因分析 - ウエハーダイシング用保護フィルムの産業動向 - ウエハーダイシング用保護フィルムのマーケットドライバー - ウエハーダイシング用保護フィルムの課題 - ウエハーダイシング用保護フィルムの阻害要因 ・主な調査結果 |
Protective film for wafer dicing is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.
Report Overview
Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Protective Film for Wafer Dicing estimated at US$ million in the year 2022, is projected to reach a revised size of US$ million by 2028, growing at a CAGR of % during the forecast period 2022-2028.
The USA market for Protective Film for Wafer Dicing is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The China market for Protective Film for Wafer Dicing is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The Europe market for Protective Film for Wafer Dicing is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The global key manufacturers of Protective Film for Wafer Dicing include Nitto, Lintec Corporation, Mitsui Chemicals Tohcello, Denka, Showa Denko Materials, Sekisui Chemical, AI Technology, Sumitomo Bakelite and Minitron, etc. In 2021, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the Protective Film for Wafer Dicing production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Protective Film for Wafer Dicing by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Report Scope
This latest report researches the industry structure, capacity, production, sales (consumption), revenue, price and gross margin. Major producers’ production locations, market shares, industry ranking and profiles are presented. The primary and secondary research is done in order to access up-to-date government regulations, market information and industry data. Data were collected from the Protective Film for Wafer Dicing manufacturers, distributors, end users, industry associations, governments’ industry bureaus, industry publications, industry experts, third party database, and our in-house databases.
This report also includes a discussion of the major players across each regional Protective Film for Wafer Dicing market. Further, it explains the major drivers and regional dynamics of the global Protective Film for Wafer Dicing market and current trends within the industry.
Key Companies Covered
In this section of the report, the researchers have done a comprehensive analysis of the prominent players operating and the strategies they are focusing on to combat the intense competition. Company profiles and market share analysis of the prominent players are also provided in this section. Additionally, the specialists have done an all-encompassing analysis of each player. They have also provided reliable sales, revenue, price, market share and rank data of the manufacturers for the period 2017-2022. With the assistance of this report, key players, stakeholders, and other participants will be able to stay abreast of the recent and upcoming developments in the business, further enabling them to make efficient choices. Mentioned below are the prime players taken into account in this research report:
Nitto
Lintec Corporation
Mitsui Chemicals Tohcello
Denka
Showa Denko Materials
Sekisui Chemical
AI Technology
Sumitomo Bakelite
Minitron
Furukawa Electric
WaferChem Technology
Loadpoint
DSK Technologies Pte Ltd
Maxell
S3 Alliance
Semiconductor Equipment Corporation
Acupaq
Great Rich Technology
D&X
AMC Co, Ltd
Market Segments
This report has explored the key segments: by Type and by Application. The lucrativeness and growth potential have been looked into by the industry experts in this report. This report also provides sales, revenue and average price forecast data by type and by application segments based on production, price, and value for the period 2017-2028.
Protective Film for Wafer Dicing Segment by Type
Non UV Film
UV Film
Protective Film for Wafer Dicing Segment by Application
Silicon Wafers
GaAs Wafers
Others
Key Regions & Countries
This section of the report provides key insights regarding various regions and the key players operating in each region. This report analyzes the Protective Film for Wafer Dicing production by region/country, and the sales (consumption) by region/country. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the value and sales data of each region and country for the period 2017-2028.
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Colombia
Middle East & Africa
Turkey
Saudi Arabia
UAE
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Protective Film for Wafer Dicing market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Report Includes:
This report presents an overview of global market for Protective Film for Wafer Dicing, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2017 – 2021, estimates for 2022, and projections of CAGR through 2028.
This report researches the key producers of Protective Film for Wafer Dicing, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Protective Film for Wafer Dicing, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Protective Film for Wafer Dicing sales, revenue, market share and industry ranking of main manufacturers, data from 2017 to 2022. Identification of the major stakeholders in the global Protective Film for Wafer Dicing market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by type and by application, sales, revenue, and price, from 2017 to 2028. Evaluation and forecast the market size for Protective Film for Wafer Dicing sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Nitto, Lintec Corporation, Mitsui Chemicals Tohcello, Denka, Showa Denko Materials, Sekisui Chemical, AI Technology, Sumitomo Bakelite and Minitron, etc.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Protective Film for Wafer Dicing capacity, production/output of global and key producers (regions/countries). It provides a quantitative analysis of the capacity, production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Protective Film for Wafer Dicing in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Protective Film for Wafer Dicing manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments according to product types, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments according to application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: Asia Pacific by type, by application and by country, sales and revenue for each segment.
Chapter 10: Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 11: Middle East and Africa by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Protective Film for Wafer Dicing sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
1 Study Coverage
1.1 Protective Film for Wafer Dicing Product Introduction
1.2 Market by Type
1.2.1 Global Protective Film for Wafer Dicing Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Non UV Film
1.2.3 UV Film
1.3 Market by Application
1.3.1 Global Protective Film for Wafer Dicing Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Silicon Wafers
1.3.3 GaAs Wafers
1.3.4 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Protective Film for Wafer Dicing Production
2.1 Global Protective Film for Wafer Dicing Production Capacity (2017-2028)
2.2 Global Protective Film for Wafer Dicing Production by Region: 2017 VS 2021 VS 2028
2.3 Global Protective Film for Wafer Dicing Production by Region
2.3.1 Global Protective Film for Wafer Dicing Historic Production by Region (2017-2022)
2.3.2 Global Protective Film for Wafer Dicing Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Global Protective Film for Wafer Dicing Sales in Volume & Value Estimates and Forecasts
3.1 Global Protective Film for Wafer Dicing Sales Estimates and Forecasts 2017-2028
3.2 Global Protective Film for Wafer Dicing Revenue Estimates and Forecasts 2017-2028
3.3 Global Protective Film for Wafer Dicing Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Protective Film for Wafer Dicing Sales by Region
3.4.1 Global Protective Film for Wafer Dicing Sales by Region (2017-2022)
3.4.2 Global Sales Protective Film for Wafer Dicing by Region (2023-2028)
3.5 Global Protective Film for Wafer Dicing Revenue by Region
3.5.1 Global Protective Film for Wafer Dicing Revenue by Region (2017-2022)
3.5.2 Global Protective Film for Wafer Dicing Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Protective Film for Wafer Dicing Production Capacity by Manufacturers
4.2 Global Protective Film for Wafer Dicing Sales by Manufacturers
4.2.1 Global Protective Film for Wafer Dicing Sales by Manufacturers (2017-2022)
4.2.2 Global Protective Film for Wafer Dicing Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Protective Film for Wafer Dicing in 2021
4.3 Global Protective Film for Wafer Dicing Revenue by Manufacturers
4.3.1 Global Protective Film for Wafer Dicing Revenue by Manufacturers (2017-2022)
4.3.2 Global Protective Film for Wafer Dicing Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Protective Film for Wafer Dicing Revenue in 2021
4.4 Global Protective Film for Wafer Dicing Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Protective Film for Wafer Dicing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Protective Film for Wafer Dicing Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Protective Film for Wafer Dicing Sales by Type
5.1.1 Global Protective Film for Wafer Dicing Historical Sales by Type (2017-2022)
5.1.2 Global Protective Film for Wafer Dicing Forecasted Sales by Type (2023-2028)
5.1.3 Global Protective Film for Wafer Dicing Sales Market Share by Type (2017-2028)
5.2 Global Protective Film for Wafer Dicing Revenue by Type
5.2.1 Global Protective Film for Wafer Dicing Historical Revenue by Type (2017-2022)
5.2.2 Global Protective Film for Wafer Dicing Forecasted Revenue by Type (2023-2028)
5.2.3 Global Protective Film for Wafer Dicing Revenue Market Share by Type (2017-2028)
5.3 Global Protective Film for Wafer Dicing Price by Type
5.3.1 Global Protective Film for Wafer Dicing Price by Type (2017-2022)
5.3.2 Global Protective Film for Wafer Dicing Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Protective Film for Wafer Dicing Sales by Application
6.1.1 Global Protective Film for Wafer Dicing Historical Sales by Application (2017-2022)
6.1.2 Global Protective Film for Wafer Dicing Forecasted Sales by Application (2023-2028)
6.1.3 Global Protective Film for Wafer Dicing Sales Market Share by Application (2017-2028)
6.2 Global Protective Film for Wafer Dicing Revenue by Application
6.2.1 Global Protective Film for Wafer Dicing Historical Revenue by Application (2017-2022)
6.2.2 Global Protective Film for Wafer Dicing Forecasted Revenue by Application (2023-2028)
6.2.3 Global Protective Film for Wafer Dicing Revenue Market Share by Application (2017-2028)
6.3 Global Protective Film for Wafer Dicing Price by Application
6.3.1 Global Protective Film for Wafer Dicing Price by Application (2017-2022)
6.3.2 Global Protective Film for Wafer Dicing Price Forecast by Application (2023-2028)
7 North America
7.1 North America Protective Film for Wafer Dicing Market Size by Type
7.1.1 North America Protective Film for Wafer Dicing Sales by Type (2017-2028)
7.1.2 North America Protective Film for Wafer Dicing Revenue by Type (2017-2028)
7.2 North America Protective Film for Wafer Dicing Market Size by Application
7.2.1 North America Protective Film for Wafer Dicing Sales by Application (2017-2028)
7.2.2 North America Protective Film for Wafer Dicing Revenue by Application (2017-2028)
7.3 North America Protective Film for Wafer Dicing Sales by Country
7.3.1 North America Protective Film for Wafer Dicing Sales by Country (2017-2028)
7.3.2 North America Protective Film for Wafer Dicing Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Protective Film for Wafer Dicing Market Size by Type
8.1.1 Europe Protective Film for Wafer Dicing Sales by Type (2017-2028)
8.1.2 Europe Protective Film for Wafer Dicing Revenue by Type (2017-2028)
8.2 Europe Protective Film for Wafer Dicing Market Size by Application
8.2.1 Europe Protective Film for Wafer Dicing Sales by Application (2017-2028)
8.2.2 Europe Protective Film for Wafer Dicing Revenue by Application (2017-2028)
8.3 Europe Protective Film for Wafer Dicing Sales by Country
8.3.1 Europe Protective Film for Wafer Dicing Sales by Country (2017-2028)
8.3.2 Europe Protective Film for Wafer Dicing Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Protective Film for Wafer Dicing Market Size by Type
9.1.1 Asia Pacific Protective Film for Wafer Dicing Sales by Type (2017-2028)
9.1.2 Asia Pacific Protective Film for Wafer Dicing Revenue by Type (2017-2028)
9.2 Asia Pacific Protective Film for Wafer Dicing Market Size by Application
9.2.1 Asia Pacific Protective Film for Wafer Dicing Sales by Application (2017-2028)
9.2.2 Asia Pacific Protective Film for Wafer Dicing Revenue by Application (2017-2028)
9.3 Asia Pacific Protective Film for Wafer Dicing Sales by Region
9.3.1 Asia Pacific Protective Film for Wafer Dicing Sales by Region (2017-2028)
9.3.2 Asia Pacific Protective Film for Wafer Dicing Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Protective Film for Wafer Dicing Market Size by Type
10.1.1 Latin America Protective Film for Wafer Dicing Sales by Type (2017-2028)
10.1.2 Latin America Protective Film for Wafer Dicing Revenue by Type (2017-2028)
10.2 Latin America Protective Film for Wafer Dicing Market Size by Application
10.2.1 Latin America Protective Film for Wafer Dicing Sales by Application (2017-2028)
10.2.2 Latin America Protective Film for Wafer Dicing Revenue by Application (2017-2028)
10.3 Latin America Protective Film for Wafer Dicing Sales by Country
10.3.1 Latin America Protective Film for Wafer Dicing Sales by Country (2017-2028)
10.3.2 Latin America Protective Film for Wafer Dicing Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
10.3.6 Colombia
11 Middle East and Africa
11.1 Middle East and Africa Protective Film for Wafer Dicing Market Size by Type
11.1.1 Middle East and Africa Protective Film for Wafer Dicing Sales by Type (2017-2028)
11.1.2 Middle East and Africa Protective Film for Wafer Dicing Revenue by Type (2017-2028)
11.2 Middle East and Africa Protective Film for Wafer Dicing Market Size by Application
11.2.1 Middle East and Africa Protective Film for Wafer Dicing Sales by Application (2017-2028)
11.2.2 Middle East and Africa Protective Film for Wafer Dicing Revenue by Application (2017-2028)
11.3 Middle East and Africa Protective Film for Wafer Dicing Sales by Country
11.3.1 Middle East and Africa Protective Film for Wafer Dicing Sales by Country (2017-2028)
11.3.2 Middle East and Africa Protective Film for Wafer Dicing Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 Nitto
12.1.1 Nitto Corporation Information
12.1.2 Nitto Overview
12.1.3 Nitto Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 Nitto Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Nitto Recent Developments
12.2 Lintec Corporation
12.2.1 Lintec Corporation Corporation Information
12.2.2 Lintec Corporation Overview
12.2.3 Lintec Corporation Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Lintec Corporation Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Lintec Corporation Recent Developments
12.3 Mitsui Chemicals Tohcello
12.3.1 Mitsui Chemicals Tohcello Corporation Information
12.3.2 Mitsui Chemicals Tohcello Overview
12.3.3 Mitsui Chemicals Tohcello Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 Mitsui Chemicals Tohcello Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Mitsui Chemicals Tohcello Recent Developments
12.4 Denka
12.4.1 Denka Corporation Information
12.4.2 Denka Overview
12.4.3 Denka Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Denka Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Denka Recent Developments
12.5 Showa Denko Materials
12.5.1 Showa Denko Materials Corporation Information
12.5.2 Showa Denko Materials Overview
12.5.3 Showa Denko Materials Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 Showa Denko Materials Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Showa Denko Materials Recent Developments
12.6 Sekisui Chemical
12.6.1 Sekisui Chemical Corporation Information
12.6.2 Sekisui Chemical Overview
12.6.3 Sekisui Chemical Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Sekisui Chemical Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Sekisui Chemical Recent Developments
12.7 AI Technology
12.7.1 AI Technology Corporation Information
12.7.2 AI Technology Overview
12.7.3 AI Technology Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 AI Technology Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 AI Technology Recent Developments
12.8 Sumitomo Bakelite
12.8.1 Sumitomo Bakelite Corporation Information
12.8.2 Sumitomo Bakelite Overview
12.8.3 Sumitomo Bakelite Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 Sumitomo Bakelite Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Sumitomo Bakelite Recent Developments
12.9 Minitron
12.9.1 Minitron Corporation Information
12.9.2 Minitron Overview
12.9.3 Minitron Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Minitron Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Minitron Recent Developments
12.10 Furukawa Electric
12.10.1 Furukawa Electric Corporation Information
12.10.2 Furukawa Electric Overview
12.10.3 Furukawa Electric Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.10.4 Furukawa Electric Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Furukawa Electric Recent Developments
12.11 WaferChem Technology
12.11.1 WaferChem Technology Corporation Information
12.11.2 WaferChem Technology Overview
12.11.3 WaferChem Technology Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.11.4 WaferChem Technology Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 WaferChem Technology Recent Developments
12.12 Loadpoint
12.12.1 Loadpoint Corporation Information
12.12.2 Loadpoint Overview
12.12.3 Loadpoint Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.12.4 Loadpoint Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 Loadpoint Recent Developments
12.13 DSK Technologies Pte Ltd
12.13.1 DSK Technologies Pte Ltd Corporation Information
12.13.2 DSK Technologies Pte Ltd Overview
12.13.3 DSK Technologies Pte Ltd Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.13.4 DSK Technologies Pte Ltd Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 DSK Technologies Pte Ltd Recent Developments
12.14 Maxell
12.14.1 Maxell Corporation Information
12.14.2 Maxell Overview
12.14.3 Maxell Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.14.4 Maxell Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Maxell Recent Developments
12.15 S3 Alliance
12.15.1 S3 Alliance Corporation Information
12.15.2 S3 Alliance Overview
12.15.3 S3 Alliance Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.15.4 S3 Alliance Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 S3 Alliance Recent Developments
12.16 Semiconductor Equipment Corporation
12.16.1 Semiconductor Equipment Corporation Corporation Information
12.16.2 Semiconductor Equipment Corporation Overview
12.16.3 Semiconductor Equipment Corporation Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.16.4 Semiconductor Equipment Corporation Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 Semiconductor Equipment Corporation Recent Developments
12.17 Acupaq
12.17.1 Acupaq Corporation Information
12.17.2 Acupaq Overview
12.17.3 Acupaq Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.17.4 Acupaq Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 Acupaq Recent Developments
12.18 Great Rich Technology
12.18.1 Great Rich Technology Corporation Information
12.18.2 Great Rich Technology Overview
12.18.3 Great Rich Technology Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.18.4 Great Rich Technology Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.18.5 Great Rich Technology Recent Developments
12.19 D&X
12.19.1 D&X Corporation Information
12.19.2 D&X Overview
12.19.3 D&X Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.19.4 D&X Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.19.5 D&X Recent Developments
12.20 AMC Co, Ltd
12.20.1 AMC Co, Ltd Corporation Information
12.20.2 AMC Co, Ltd Overview
12.20.3 AMC Co, Ltd Protective Film for Wafer Dicing Sales, Price, Revenue and Gross Margin (2017-2022)
12.20.4 AMC Co, Ltd Protective Film for Wafer Dicing Product Model Numbers, Pictures, Descriptions and Specifications
12.20.5 AMC Co, Ltd Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Protective Film for Wafer Dicing Industry Chain Analysis
13.2 Protective Film for Wafer Dicing Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Protective Film for Wafer Dicing Production Mode & Process
13.4 Protective Film for Wafer Dicing Sales and Marketing
13.4.1 Protective Film for Wafer Dicing Sales Channels
13.4.2 Protective Film for Wafer Dicing Distributors
13.5 Protective Film for Wafer Dicing Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Protective Film for Wafer Dicing Industry Trends
14.2 Protective Film for Wafer Dicing Market Drivers
14.3 Protective Film for Wafer Dicing Market Challenges
14.4 Protective Film for Wafer Dicing Market Restraints
15 Key Finding in The Global Protective Film for Wafer Dicing Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
| 【ウエハーダイシング用保護フィルムについて】 ウエハーダイシング用保護フィルムは、半導体製造プロセスの中で重要な役割を果たす素材であり、特にウエハのダイシング（切断）工程において欠かせない存在です。このフィルムは、ウエハの表面を保護し、切断時に発生するさまざまなリスクからデバイスを守るために使用されます。それでは、ウエハーダイシング用保護フィルムの概念について、定義、特徴、種類、用途、関連技術などを詳しく説明いたします。 ウエハーダイシング用保護フィルムの定義としては、まずこのフィルムは、半導体ウエハの表面を保護するために特別に設計された薄いフィルムであると言えます。一般的に、ウエハは非常に脆弱であり、物理的な衝撃や化学的な影響によって損傷を受けやすい特性があります。そのため、ダイシング工程ではウエハの損傷を避けるために、保護フィルムを使用します。 保護フィルムの特徴として、まずその耐久性が挙げられます。ウエハに貼り付けられる際、フィルムは高い耐熱性と耐薬品性を備えています。このため、切断プロセス中の高温や化学物質による影響を受けにくいのです。また、フィルムは非常に薄く、軽量であるため、ダイシングプロセスにおいてウエハの形状や寸法にほとんど影響を与えません。 次に、付着力の特性も重要です。ウエハーダイシング用保護フィルムは、ウエハ表面への付着力が強く、切断中や工程後に脱落することがないように設計されています。これにより、切断工程の安定性が向上し、最終的なデバイスの品質が確保されます。 ウエハーダイシング用保護フィルムには、いくつかの種類があり、それぞれ異なる特性を持っています。一般的な種類には、ポリイミドフィルム、ポリプロピレンフィルム、アクリルフィルムなどがあります。ポリイミドフィルムは、特に高温耐性に優れており、高い絶縁性を持つため、半導体デバイスの製造に広く使用されています。ポリプロピレンフィルムは、度重なる熱サイクルに対する耐性があり、コストパフォーマンスにも優れています。アクリルフィルムは、非常に薄く透明性が高いため、光学デバイスへの応用にも適しています。 これらのフィルムの用途は多岐にわたりますが、主に半導体製造プロセスにおけるウエハの保護が目的です。特に、ダイシング工程では、フィルムがウエハの表面を物理的衝撃から守り、ひび割れや欠損を防ぐ役割を果たします。また、フィルムはウエハの搬送や保管中にも、その表面を保護するために使用されます。 関連技術としては、ウエハ加工技術やダイシング装置の進化が挙げられます。最近では、レーザーダイシング技術やワイヤーダイシング技術が進化しており、これに伴い保護フィルムの性能も向上しています。特に、レーザーダイシングでは、従来のブレードを使用した切断方法と比較して、ストレスが少なく、より高精度な切断が行えるため、保護フィルムの重要性が増しています。 さらに、環境への配慮から、リサイクル可能な素材を使用したエコフレンドリーな保護フィルムも開発されています。これにより、持続可能な製造プロセスが実現され、環境への負荷を低減することが期待されています。 ウエハーダイシング用保護フィルムは、半導体業界の中で重要な役割を果たしており、その技術や特性は日々進化しています。今後も、さらなる高性能化や環境への配慮が進むことで、ウエハのダイシング工程の効率化や品質向上が図られると考えられます。デバイスの微細化が進展する中で、保護フィルムの重要性はますます増しており、半導体製造プロセスの中で必要不可欠な要素であることを再確認しました。 |