市場調査レポート：世界の自動ウェーハダイシング装置市場（～2028年）：メカニカルダイシング装置、レーザーダイシング装置

• 英文タイトル：Global Automatic Wafer Dicing Equipment Market Insights, Forecast to 2028

Global Automatic Wafer Dicing Equipment Market Insights, Forecast to 2028「世界の自動ウェーハダイシング装置市場（～2028年）：メカニカルダイシング装置、レーザーダイシング装置」（市場規模、市場予測）調査レポートです。

• レポートコード：MRC2Q12-12433
• 出版社/出版日：QYResearch / 2022年12月
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• レポート形態：英文、PDF、89ページ
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• 産業分類：産業機械&装置

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レポート概要

新型コロナウイルス感染症とロシア・ウクライナ戦争の影響により、自動ウェーハダイシング装置のグローバル市場は 2022にxxxドルと推定され、2028年までにxxxドルの規模に達し、2022年から2028年の予測期間中にxxx%のCAGRで成長すると予測されています。
自動ウェーハダイシング装置のアメリカ市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。
自動ウェーハダイシング装置の中国市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。
自動ウェーハダイシング装置のヨーロッパ市場は、2023年から2028年の予測期間中にxxx%のCAGRで、2022年xxxドルから2028年xxxドルに達すると推定されています。

生産面において、本レポートは2017年から2022年までの自動ウェーハダイシング装置の生産、成長率、メーカー別市場シェア、地域別市場シェア、および2028年までの予測を調査しています。販売面において、本レポートは2017年から2022年までの地域別、企業別、タイプ別、アプリケーション別の自動ウェーハダイシング装置の売上および2028年までの予測に焦点を当てています。

自動ウェーハダイシング装置のグローバル主要企業には、DISCO、Tokyo Seimitsu (ACCRETECH)、ASM、Synova、GLTech (Advanced Dicing Technologies (ADT))、Shenyang Heyan Technology、Jiangsu Jing Chuang、CETC、Hi-Testなどがあります。2021年、世界のトップ5プレイヤーは売上ベースで約xxx％の市場シェアを占めています。

自動ウェーハダイシング装置市場は、タイプとアプリケーションによって区分されます。世界の自動ウェーハダイシング装置市場のプレーヤー、利害関係者、およびその他の参加者は、当レポートを有益なリソースとして使用することで優位に立つことができます。セグメント分析は、2017年～2028年期間のタイプ別およびアプリケーション別の販売量、売上、予測に焦点を当てています。

【タイプ別セグメント】
メカニカルダイシング装置、レーザーダイシング装置

【アプリケーション別セグメント】
シリコンウェーハ、SiCウェーハ、サファイアウェーハ、その他

【掲載地域】
北米：アメリカ、カナダ
ヨーロッパ：ドイツ、フランス、イギリス、イタリア、ロシア
アジア太平洋：日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア
中南米：メキシコ、ブラジル、アルゼンチン
中東・アフリカ：トルコ、サウジアラビア、UAE

【目次（一部）】

・調査の範囲
- 自動ウェーハダイシング装置製品概要
- タイプ別市場（メカニカルダイシング装置、レーザーダイシング装置）
- アプリケーション別市場（シリコンウェーハ、SiCウェーハ、サファイアウェーハ、その他）
- 調査の目的
・エグゼクティブサマリー
- 世界の自動ウェーハダイシング装置販売量予測2017-2028
- 世界の自動ウェーハダイシング装置売上予測2017-2028
- 自動ウェーハダイシング装置の地域別販売量
- 自動ウェーハダイシング装置の地域別売上
- 北米市場
- ヨーロッパ市場
- アジア太平洋市場
- 中南米市場
- 中東・アフリカ市場
・メーカーの競争状況
- 主要メーカー別自動ウェーハダイシング装置販売量
- 主要メーカー別自動ウェーハダイシング装置売上
- 主要メーカー別自動ウェーハダイシング装置価格
- 競争状況の分析
- 企業M&A動向
・タイプ別市場規模（メカニカルダイシング装置、レーザーダイシング装置）
- 自動ウェーハダイシング装置のタイプ別販売量
- 自動ウェーハダイシング装置のタイプ別売上
- 自動ウェーハダイシング装置のタイプ別価格
・アプリケーション別市場規模（シリコンウェーハ、SiCウェーハ、サファイアウェーハ、その他）
- 自動ウェーハダイシング装置のアプリケーション別販売量
- 自動ウェーハダイシング装置のアプリケーション別売上
- 自動ウェーハダイシング装置のアプリケーション別価格
・北米市場
- 北米の自動ウェーハダイシング装置市場規模（タイプ別、アプリケーション別）
- 主要国別の自動ウェーハダイシング装置市場規模（アメリカ、カナダ）
・ヨーロッパ市場
- ヨーロッパの自動ウェーハダイシング装置市場規模（タイプ別、アプリケーション別）
- 主要国別の自動ウェーハダイシング装置市場規模（ドイツ、フランス、イギリス、イタリア、ロシア）
・アジア太平洋市場
- アジア太平洋の自動ウェーハダイシング装置市場規模（タイプ別、アプリケーション別）
- 主要国別の自動ウェーハダイシング装置市場規模（日本、中国、韓国、インド、オーストラリア、台湾、インドネシア、タイ、マレーシア）
・中南米市場
- 中南米の自動ウェーハダイシング装置市場規模（タイプ別、アプリケーション別）
- 主要国別の自動ウェーハダイシング装置市場規模（メキシコ、ブラジル、アルゼンチン）
・中東・アフリカ市場
- 中東・アフリカの自動ウェーハダイシング装置市場規模（タイプ別、アプリケーション別）
- 主要国別の自動ウェーハダイシング装置市場規模（トルコ、サウジアラビア）
・企業情報
DISCO、Tokyo Seimitsu (ACCRETECH)、ASM、Synova、GLTech (Advanced Dicing Technologies (ADT))、Shenyang Heyan Technology、Jiangsu Jing Chuang、CETC、Hi-Test
・産業チェーン及び販売チャネル分析
- 自動ウェーハダイシング装置の産業チェーン分析
- 自動ウェーハダイシング装置の原材料
- 自動ウェーハダイシング装置の生産プロセス
- 自動ウェーハダイシング装置の販売及びマーケティング
- 自動ウェーハダイシング装置の主要顧客
・マーケットドライバー、機会、課題、リスク要因分析
- 自動ウェーハダイシング装置の産業動向
- 自動ウェーハダイシング装置のマーケットドライバー
- 自動ウェーハダイシング装置の課題
- 自動ウェーハダイシング装置の阻害要因
・主な調査結果

Report Overview
Due to the COVID-19 pandemic and Russia-Ukraine War Influence, the global market for Automatic Wafer Dicing Equipment estimated at US$ million in the year 2022, is projected to reach a revised size of US$ million by 2028, growing at a CAGR of % during the forecast period 2022-2028.
The USA market for Automatic Wafer Dicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The China market for Automatic Wafer Dicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The Europe market for Automatic Wafer Dicing Equipment is estimated to increase from $ million in 2022 to reach $ million by 2028, at a CAGR of % during the forecast period of 2023 through 2028.
The global key manufacturers of Automatic Wafer Dicing Equipment include DISCO, Tokyo Seimitsu (ACCRETECH), ASM, Synova, GLTech (Advanced Dicing Technologies (ADT)), Shenyang Heyan Technology, Jiangsu Jing Chuang, CETC and Hi-Test, etc. In 2021, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the Automatic Wafer Dicing Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Automatic Wafer Dicing Equipment by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Report Scope
This latest report researches the industry structure, capacity, production, sales (consumption), revenue, price and gross margin. Major producers’ production locations, market shares, industry ranking and profiles are presented. The primary and secondary research is done in order to access up-to-date government regulations, market information and industry data. Data were collected from the Automatic Wafer Dicing Equipment manufacturers, distributors, end users, industry associations, governments’ industry bureaus, industry publications, industry experts, third party database, and our in-house databases.
This report also includes a discussion of the major players across each regional Automatic Wafer Dicing Equipment market. Further, it explains the major drivers and regional dynamics of the global Automatic Wafer Dicing Equipment market and current trends within the industry.
Key Companies Covered
In this section of the report, the researchers have done a comprehensive analysis of the prominent players operating and the strategies they are focusing on to combat the intense competition. Company profiles and market share analysis of the prominent players are also provided in this section. Additionally, the specialists have done an all-encompassing analysis of each player. They have also provided reliable sales, revenue, price, market share and rank data of the manufacturers for the period 2017-2022. With the assistance of this report, key players, stakeholders, and other participants will be able to stay abreast of the recent and upcoming developments in the business, further enabling them to make efficient choices. Mentioned below are the prime players taken into account in this research report:
DISCO
Tokyo Seimitsu (ACCRETECH)
ASM
Synova
GLTech (Advanced Dicing Technologies (ADT))
Shenyang Heyan Technology
Jiangsu Jing Chuang
CETC
Hi-Test
Market Segments
This report has explored the key segments: by Type and by Application. The lucrativeness and growth potential have been looked into by the industry experts in this report. This report also provides sales, revenue and average price forecast data by type and by application segments based on production, price, and value for the period 2017-2028.
Automatic Wafer Dicing Equipment Segment by Type
Mechanical Dicing Equipment
Laser Dicing Equipment
Automatic Wafer Dicing Equipment Segment by Application
Silicon Wafer
SiC Wafer
Sapphire Wafer
Others
Key Regions & Countries
This section of the report provides key insights regarding various regions and the key players operating in each region. This report analyzes the Automatic Wafer Dicing Equipment production by region/country, and the sales (consumption) by region/country. Economic, social, environmental, technological, and political factors have been taken into consideration while assessing the growth of the particular region/country. The readers will also get their hands on the value and sales data of each region and country for the period 2017-2028.
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Key Drivers & Barriers
High-impact rendering factors and drivers have been studied in this report to aid the readers to understand the general development. Moreover, the report includes restraints and challenges that may act as stumbling blocks on the way of the players. This will assist the users to be attentive and make informed decisions related to business. Specialists have also laid their focus on the upcoming business prospects.
COVID-19 and Russia-Ukraine War Influence Analysis
The readers in the section will understand how the Automatic Wafer Dicing Equipment market scenario changed across the globe during the pandemic, post-pandemic and Russia-Ukraine War. The study is done keeping in view the changes in aspects such as demand, consumption, transportation, consumer behavior, supply chain management, export and import, and production. The industry experts have also highlighted the key factors that will help create opportunities for players and stabilize the overall industry in the years to come.
Report Includes:
This report presents an overview of global market for Automatic Wafer Dicing Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2017 – 2021, estimates for 2022, and projections of CAGR through 2028.
This report researches the key producers of Automatic Wafer Dicing Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Automatic Wafer Dicing Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Automatic Wafer Dicing Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2017 to 2022. Identification of the major stakeholders in the global Automatic Wafer Dicing Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by type and by application, sales, revenue, and price, from 2017 to 2028. Evaluation and forecast the market size for Automatic Wafer Dicing Equipment sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including DISCO, Tokyo Seimitsu (ACCRETECH), ASM, Synova, GLTech (Advanced Dicing Technologies (ADT)), Shenyang Heyan Technology, Jiangsu Jing Chuang, CETC and Hi-Test, etc.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Automatic Wafer Dicing Equipment capacity, production/output of global and key producers (regions/countries). It provides a quantitative analysis of the capacity, production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Automatic Wafer Dicing Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Automatic Wafer Dicing Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments according to product types, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments according to application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: Asia Pacific by type, by application and by country, sales and revenue for each segment.
Chapter 10: Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 11: Middle East and Africa by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Automatic Wafer Dicing Equipment sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.

レポート目次

1 Study Coverage
1.1 Automatic Wafer Dicing Equipment Product Introduction
1.2 Market by Type
1.2.1 Global Automatic Wafer Dicing Equipment Market Size by Type, 2017 VS 2021 VS 2028
1.2.2 Mechanical Dicing Equipment
1.2.3 Laser Dicing Equipment
1.3 Market by Application
1.3.1 Global Automatic Wafer Dicing Equipment Market Size by Application, 2017 VS 2021 VS 2028
1.3.2 Silicon Wafer
1.3.3 SiC Wafer
1.3.4 Sapphire Wafer
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
2 Global Automatic Wafer Dicing Equipment Production
2.1 Global Automatic Wafer Dicing Equipment Production Capacity (2017-2028)
2.2 Global Automatic Wafer Dicing Equipment Production by Region: 2017 VS 2021 VS 2028
2.3 Global Automatic Wafer Dicing Equipment Production by Region
2.3.1 Global Automatic Wafer Dicing Equipment Historic Production by Region (2017-2022)
2.3.2 Global Automatic Wafer Dicing Equipment Forecasted Production by Region (2023-2028)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
3 Global Automatic Wafer Dicing Equipment Sales in Volume & Value Estimates and Forecasts
3.1 Global Automatic Wafer Dicing Equipment Sales Estimates and Forecasts 2017-2028
3.2 Global Automatic Wafer Dicing Equipment Revenue Estimates and Forecasts 2017-2028
3.3 Global Automatic Wafer Dicing Equipment Revenue by Region: 2017 VS 2021 VS 2028
3.4 Global Automatic Wafer Dicing Equipment Sales by Region
3.4.1 Global Automatic Wafer Dicing Equipment Sales by Region (2017-2022)
3.4.2 Global Sales Automatic Wafer Dicing Equipment by Region (2023-2028)
3.5 Global Automatic Wafer Dicing Equipment Revenue by Region
3.5.1 Global Automatic Wafer Dicing Equipment Revenue by Region (2017-2022)
3.5.2 Global Automatic Wafer Dicing Equipment Revenue by Region (2023-2028)
3.6 North America
3.7 Europe
3.8 Asia-Pacific
3.9 Latin America
3.10 Middle East & Africa
4 Competition by Manufactures
4.1 Global Automatic Wafer Dicing Equipment Production Capacity by Manufacturers
4.2 Global Automatic Wafer Dicing Equipment Sales by Manufacturers
4.2.1 Global Automatic Wafer Dicing Equipment Sales by Manufacturers (2017-2022)
4.2.2 Global Automatic Wafer Dicing Equipment Sales Market Share by Manufacturers (2017-2022)
4.2.3 Global Top 10 and Top 5 Largest Manufacturers of Automatic Wafer Dicing Equipment in 2021
4.3 Global Automatic Wafer Dicing Equipment Revenue by Manufacturers
4.3.1 Global Automatic Wafer Dicing Equipment Revenue by Manufacturers (2017-2022)
4.3.2 Global Automatic Wafer Dicing Equipment Revenue Market Share by Manufacturers (2017-2022)
4.3.3 Global Top 10 and Top 5 Companies by Automatic Wafer Dicing Equipment Revenue in 2021
4.4 Global Automatic Wafer Dicing Equipment Sales Price by Manufacturers
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Automatic Wafer Dicing Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.5.3 Global Automatic Wafer Dicing Equipment Manufacturers Geographical Distribution
4.6 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Automatic Wafer Dicing Equipment Sales by Type
5.1.1 Global Automatic Wafer Dicing Equipment Historical Sales by Type (2017-2022)
5.1.2 Global Automatic Wafer Dicing Equipment Forecasted Sales by Type (2023-2028)
5.1.3 Global Automatic Wafer Dicing Equipment Sales Market Share by Type (2017-2028)
5.2 Global Automatic Wafer Dicing Equipment Revenue by Type
5.2.1 Global Automatic Wafer Dicing Equipment Historical Revenue by Type (2017-2022)
5.2.2 Global Automatic Wafer Dicing Equipment Forecasted Revenue by Type (2023-2028)
5.2.3 Global Automatic Wafer Dicing Equipment Revenue Market Share by Type (2017-2028)
5.3 Global Automatic Wafer Dicing Equipment Price by Type
5.3.1 Global Automatic Wafer Dicing Equipment Price by Type (2017-2022)
5.3.2 Global Automatic Wafer Dicing Equipment Price Forecast by Type (2023-2028)
6 Market Size by Application
6.1 Global Automatic Wafer Dicing Equipment Sales by Application
6.1.1 Global Automatic Wafer Dicing Equipment Historical Sales by Application (2017-2022)
6.1.2 Global Automatic Wafer Dicing Equipment Forecasted Sales by Application (2023-2028)
6.1.3 Global Automatic Wafer Dicing Equipment Sales Market Share by Application (2017-2028)
6.2 Global Automatic Wafer Dicing Equipment Revenue by Application
6.2.1 Global Automatic Wafer Dicing Equipment Historical Revenue by Application (2017-2022)
6.2.2 Global Automatic Wafer Dicing Equipment Forecasted Revenue by Application (2023-2028)
6.2.3 Global Automatic Wafer Dicing Equipment Revenue Market Share by Application (2017-2028)
6.3 Global Automatic Wafer Dicing Equipment Price by Application
6.3.1 Global Automatic Wafer Dicing Equipment Price by Application (2017-2022)
6.3.2 Global Automatic Wafer Dicing Equipment Price Forecast by Application (2023-2028)
7 North America
7.1 North America Automatic Wafer Dicing Equipment Market Size by Type
7.1.1 North America Automatic Wafer Dicing Equipment Sales by Type (2017-2028)
7.1.2 North America Automatic Wafer Dicing Equipment Revenue by Type (2017-2028)
7.2 North America Automatic Wafer Dicing Equipment Market Size by Application
7.2.1 North America Automatic Wafer Dicing Equipment Sales by Application (2017-2028)
7.2.2 North America Automatic Wafer Dicing Equipment Revenue by Application (2017-2028)
7.3 North America Automatic Wafer Dicing Equipment Sales by Country
7.3.1 North America Automatic Wafer Dicing Equipment Sales by Country (2017-2028)
7.3.2 North America Automatic Wafer Dicing Equipment Revenue by Country (2017-2028)
7.3.3 United States
7.3.4 Canada
8 Europe
8.1 Europe Automatic Wafer Dicing Equipment Market Size by Type
8.1.1 Europe Automatic Wafer Dicing Equipment Sales by Type (2017-2028)
8.1.2 Europe Automatic Wafer Dicing Equipment Revenue by Type (2017-2028)
8.2 Europe Automatic Wafer Dicing Equipment Market Size by Application
8.2.1 Europe Automatic Wafer Dicing Equipment Sales by Application (2017-2028)
8.2.2 Europe Automatic Wafer Dicing Equipment Revenue by Application (2017-2028)
8.3 Europe Automatic Wafer Dicing Equipment Sales by Country
8.3.1 Europe Automatic Wafer Dicing Equipment Sales by Country (2017-2028)
8.3.2 Europe Automatic Wafer Dicing Equipment Revenue by Country (2017-2028)
8.3.3 Germany
8.3.4 France
8.3.5 U.K.
8.3.6 Italy
8.3.7 Russia
9 Asia Pacific
9.1 Asia Pacific Automatic Wafer Dicing Equipment Market Size by Type
9.1.1 Asia Pacific Automatic Wafer Dicing Equipment Sales by Type (2017-2028)
9.1.2 Asia Pacific Automatic Wafer Dicing Equipment Revenue by Type (2017-2028)
9.2 Asia Pacific Automatic Wafer Dicing Equipment Market Size by Application
9.2.1 Asia Pacific Automatic Wafer Dicing Equipment Sales by Application (2017-2028)
9.2.2 Asia Pacific Automatic Wafer Dicing Equipment Revenue by Application (2017-2028)
9.3 Asia Pacific Automatic Wafer Dicing Equipment Sales by Region
9.3.1 Asia Pacific Automatic Wafer Dicing Equipment Sales by Region (2017-2028)
9.3.2 Asia Pacific Automatic Wafer Dicing Equipment Revenue by Region (2017-2028)
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.3.6 India
9.3.7 Australia
9.3.8 China Taiwan
9.3.9 Indonesia
9.3.10 Thailand
9.3.11 Malaysia
10 Latin America
10.1 Latin America Automatic Wafer Dicing Equipment Market Size by Type
10.1.1 Latin America Automatic Wafer Dicing Equipment Sales by Type (2017-2028)
10.1.2 Latin America Automatic Wafer Dicing Equipment Revenue by Type (2017-2028)
10.2 Latin America Automatic Wafer Dicing Equipment Market Size by Application
10.2.1 Latin America Automatic Wafer Dicing Equipment Sales by Application (2017-2028)
10.2.2 Latin America Automatic Wafer Dicing Equipment Revenue by Application (2017-2028)
10.3 Latin America Automatic Wafer Dicing Equipment Sales by Country
10.3.1 Latin America Automatic Wafer Dicing Equipment Sales by Country (2017-2028)
10.3.2 Latin America Automatic Wafer Dicing Equipment Revenue by Country (2017-2028)
10.3.3 Mexico
10.3.4 Brazil
10.3.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa Automatic Wafer Dicing Equipment Market Size by Type
11.1.1 Middle East and Africa Automatic Wafer Dicing Equipment Sales by Type (2017-2028)
11.1.2 Middle East and Africa Automatic Wafer Dicing Equipment Revenue by Type (2017-2028)
11.2 Middle East and Africa Automatic Wafer Dicing Equipment Market Size by Application
11.2.1 Middle East and Africa Automatic Wafer Dicing Equipment Sales by Application (2017-2028)
11.2.2 Middle East and Africa Automatic Wafer Dicing Equipment Revenue by Application (2017-2028)
11.3 Middle East and Africa Automatic Wafer Dicing Equipment Sales by Country
11.3.1 Middle East and Africa Automatic Wafer Dicing Equipment Sales by Country (2017-2028)
11.3.2 Middle East and Africa Automatic Wafer Dicing Equipment Revenue by Country (2017-2028)
11.3.3 Turkey
11.3.4 Saudi Arabia
11.3.5 UAE
12 Corporate Profiles
12.1 DISCO
12.1.1 DISCO Corporation Information
12.1.2 DISCO Overview
12.1.3 DISCO Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.1.4 DISCO Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 DISCO Recent Developments
12.2 Tokyo Seimitsu (ACCRETECH)
12.2.1 Tokyo Seimitsu (ACCRETECH) Corporation Information
12.2.2 Tokyo Seimitsu (ACCRETECH) Overview
12.2.3 Tokyo Seimitsu (ACCRETECH) Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.2.4 Tokyo Seimitsu (ACCRETECH) Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Tokyo Seimitsu (ACCRETECH) Recent Developments
12.3 ASM
12.3.1 ASM Corporation Information
12.3.2 ASM Overview
12.3.3 ASM Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.3.4 ASM Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 ASM Recent Developments
12.4 Synova
12.4.1 Synova Corporation Information
12.4.2 Synova Overview
12.4.3 Synova Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.4.4 Synova Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Synova Recent Developments
12.5 GLTech (Advanced Dicing Technologies (ADT))
12.5.1 GLTech (Advanced Dicing Technologies (ADT)) Corporation Information
12.5.2 GLTech (Advanced Dicing Technologies (ADT)) Overview
12.5.3 GLTech (Advanced Dicing Technologies (ADT)) Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.5.4 GLTech (Advanced Dicing Technologies (ADT)) Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 GLTech (Advanced Dicing Technologies (ADT)) Recent Developments
12.6 Shenyang Heyan Technology
12.6.1 Shenyang Heyan Technology Corporation Information
12.6.2 Shenyang Heyan Technology Overview
12.6.3 Shenyang Heyan Technology Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.6.4 Shenyang Heyan Technology Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Shenyang Heyan Technology Recent Developments
12.7 Jiangsu Jing Chuang
12.7.1 Jiangsu Jing Chuang Corporation Information
12.7.2 Jiangsu Jing Chuang Overview
12.7.3 Jiangsu Jing Chuang Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.7.4 Jiangsu Jing Chuang Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Jiangsu Jing Chuang Recent Developments
12.8 CETC
12.8.1 CETC Corporation Information
12.8.2 CETC Overview
12.8.3 CETC Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.8.4 CETC Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 CETC Recent Developments
12.9 Hi-Test
12.9.1 Hi-Test Corporation Information
12.9.2 Hi-Test Overview
12.9.3 Hi-Test Automatic Wafer Dicing Equipment Sales, Price, Revenue and Gross Margin (2017-2022)
12.9.4 Hi-Test Automatic Wafer Dicing Equipment Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Hi-Test Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Automatic Wafer Dicing Equipment Industry Chain Analysis
13.2 Automatic Wafer Dicing Equipment Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Automatic Wafer Dicing Equipment Production Mode & Process
13.4 Automatic Wafer Dicing Equipment Sales and Marketing
13.4.1 Automatic Wafer Dicing Equipment Sales Channels
13.4.2 Automatic Wafer Dicing Equipment Distributors
13.5 Automatic Wafer Dicing Equipment Customers
14 Market Drivers, Opportunities, Challenges and Risks Factors Analysis
14.1 Automatic Wafer Dicing Equipment Industry Trends
14.2 Automatic Wafer Dicing Equipment Market Drivers
14.3 Automatic Wafer Dicing Equipment Market Challenges
14.4 Automatic Wafer Dicing Equipment Market Restraints
15 Key Finding in The Global Automatic Wafer Dicing Equipment Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer

【自動ウェーハダイシング装置について】

自動ウェーハダイシング装置は、半導体製造プロセスにおいて、ウェーハを複数のダイ（チップ）に切り分けるための重要な機器です。このプロセスは、電子機器や通信機器に使用される各種半導体デバイスの製造に欠かせない工程であり、ウェーハを大きな一枚のシリコンから個別のデバイスに変換する役割を担っています。本稿では、自動ウェーハダイシング装置の概念について、定義、特徴、種類、用途、関連技術などを解説いたします。

自動ウェーハダイシング装置の定義は、ウェーハ切断のプロセスを自動化するための装置であり、高精度で効率的なダイの切り分けを実現するための機能を備えています。これにより、生産性が向上し、エラーの発生率が低下することが期待されます。特に、現代の半導体産業では、小型化や高集積化が進行しており、ダイシング工程に求められる精度や速度がますます厳しくなっています。

特徴として、自動ウェーハダイシング装置は、まずウェーハの位置決め、次に切断ラインのパスの設定、さらに切断プロセスの制御を自動で行います。これにより、切断精度が向上し、ダイの破損リスクを低減させることが可能になります。また、多くの装置では、レーザーやダイヤモンドワイヤーソーといった最新の切断技術を採用しており、高速かつ高品質な仕上がりを実現しています。さらに、これらの装置は据え置き型とポータブル型の2種類に分類され、使用される目的やスぺースに応じて選択できる柔軟性も持っています。

種類についてですが、一般的には、ダイヤモンドワイヤーソーによる切断装置、レーザー切断装置、ブレード切断装置、さらにはエッチング技術を用いる装置に分かれます。ダイヤモンドワイヤーソーは、効率的で細かい切断が可能ですが、装置とワイヤーの保守が重要になります。レーザー切断装置は、熱による影響を受けずに短時間で切断が可能で、特に薄いウェーハに対して威力を発揮します。ブレード切断装置は、従来の技術であり、安定した切断速度と精度を提供しますが、熱による影響を考慮する必要があります。エッチング技術は、化学薬品を用いて表面に作用させ、目的の形状を形成する方式であり、高精度な加工が可能です。

用途においては、自動ウェーハダイシング装置は、半導体デバイスの製造に広く用いられています。具体的には、マイクロプロセッサ、メモリーチップ、センサー、パワーデバイス、LED（発光ダイオード）など、多岐にわたる製品が対象です。また、今後ますます進化するIoT（モノのインターネット）やAI（人工知能）関連のデバイスにおいても、精密なダイシングが求められ、新たな市場が開拓されていくと考えられます。

関連技術としては、切断方法の進歩とともに、それを支えるための技術も発展しています。例えば、ウェーハの前処理における技術や、後処理に関する技術などがあります。前処理では、ウェーハの表面をきれいに整えるための洗浄技術や、ガルバニックホール法と呼ばれる特殊な方法が用いられることがあります。後処理では、切断後のダイを保護するための樹脂封止技術や、最終検査に関する自動検査技術が重要です。

さらに、ウェーハダイシング技術は、環境負荷の低減を図るために、再生可能な材料の使用や、省エネルギー技術の導入も進んでいます。これにより、製造プロセス全体の持続可能性を高めつつ、コスト削減も実現可能です。

近年、業界ではアセンブリ全体の自動化やプロセスの統合が進んでおり、自動ウェーハダイシング装置もそのトレンドに乗る形で進化しています。これにより、生産ライン全体の効率を高めるための情報共有やデータ分析の活用が進んでおり、スマートファクトリーという新たな概念が実現に向けて進展しています。

自動ウェーハダイシング装置は、半導体製造の現場において、今後もますます重要な役割を担うことでしょう。技術の進展とともに、より効率的で高精度なダイシングが可能となることで、さらなる市場の成長が期待されます。